Equipment and Materials ♦ news digest
which works across a vast range of coating materials and substrates. By adjusting processing parameters, the structure and properties of the coating can be tailored to the requirements of the application, even for nanostructure-scale surface coatings.
The US PLD technology delivers very high coating integrity without pinholes, giving improved reliability in applications where through-thickness defects may cause delamination of thin films and serious damage to components.
In addition to diamond-like coatings, US PLD technology, under the tradename Coldab, enables the deposition of carbon nitrides, carbon nitride composites containing PTFE or boron nitride (BN) as well as a wide range of other borides, oxides and precious metal thin films.
Picodeon says its Coldab US PLD technology enables high production rates and coating qualities and opens new possibilities and applications for pulsed laser deposition coatings.
In selected areas it may even enable the development of exclusive coating methods.
Sensirion launches flexible flow sensor
The sensor has no moving parts and is claimed to have the lhighest sensitivity down to the lowest flow rates
Sensirion’s new SLQ-QT500 features a flow range up to 120 ml/min for water-based liquids as well as hydrocarbon based liquids.
particles as long as they are not abrasive in the quartz glass tube.
A smart digital interface and RS485 communication is offered for long distance and bus capabilities. The firm believes the sensitivity and measuring speed offer new possibilities for the monitoring or control of fast dosing operations.
The instantaneous flow rate of the fluid is available as well the output of a total dosed volume with automatic dosing detection. The sensor is available with calibration for H2O and isopropanol (IPA).
Features
For flow rates up to 120 ml/min (hydrocarbons and water based liquids)
Fast response time down to 30 ms For high and low viscosity liquids For liquids with small particles RS485 digital interface
Straight flow path, no moving parts Assured purity
Highest sensitivity down to the lowest flow rates Superb chemical resistance, inert materials Wetted materials: PFA and quartz glass only Maximum working pressure 10 bar
EV Group on a roll partly thanks to III-Vs
The demand for flexible, high-volume manufacturing solutions in 3the power device and compound semiconductor markets are partly driving growth at the company
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the semiconductor markets, has achieved strong revenue growth and expanded its headcount for the first half of 2013.
The company attributes this success to continuing demand for its flexible process solutions designed to address high-volume manufacturing (HVM) needs across multiple markets - including compound semiconductors, power devices, 3D-ICs and MEMS.
SLQ-QT500
It is suited for the integration into demanding coating systems in the semiconductor industry.
Applications include high-end semiconductor process control, industrial automation and fast dosing operations .
Based on Sensirion’s thermal microsensor technology, the wetted parts are the PFA fittings and the quartz glass tube. The whole fluidic path is straight and there are no obstacles or moving parts in the sensor.
Sensiron says its SLQ-QT500 is ideally suited for liquids with virtually any viscosity as well as liquids which contain small
EVG’s latest technology innovations that address these and other markets will be showcased this week at SEMICON West 2013 at the Moscone Convention Centre in San Francisco. In addition to unveiling a series of new solutions, EVG also says it continues to expand its wafer processing services and process development consultation capabilities worldwide as part of the company’s long-term growth strategy.
“2013 has been a strong year for EV Group as we continue to invest in new technologies and capabilities to support our customers’ ability to ramp next-generation devices to volume production quickly and cost-effectively at high yields,” says Dave Kirsch, vice president and general manager of EV Group North America.
“This requires not only leading-edge process equipment but also world-class global support and process development
August/September 2013
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