Page 92
hi-TeCh evenTS
www.us-tech.com DesignCon 2013 Scheduled for Santa Clara
Santa Clara, CA — Recognized throughout the semiconductor and electronic design industries as the pre- miere annual trade event, De sign Con 2013 is scheduled for January 28-31 in Santa Clara, Calif. Hosted by UBM Electronics, the 14-track technical DesignCon conference program will include more than 100 in-depth tutori- als, technical paper sessions and panel discussions. In addition, the two-day DesignCon expo program will debut
with visionary keynote presentations, a progressive educational forum staged by DesignCon 2013 host spon- sor, Agilent Technologies, and an expanded focus on training sessions, teardowns and technology solutions. “With its unwavering focus on
intensive technical education and networking, DesignCon is the defini- tive annual event for the chip, board and systems design community,” said Patrick Mannion, Content Dir -
NEPCON China Set for April
Shanghai, China —The 23rd edition of NEPCON China will take place at the Shanghai World Expo Con vention & Exhibition Center April 23-25, 2013. A vivid exposition of current industry hotspots and future trends, NEPCON China 2013, will showcase traditional electronics manufacturing equipment and materials. It will also feature a brand new Electronics Manufacturing Automa tion Pavilion, in response to exhibitor and visitor demand. As Asia’s largest SMT and elec-
tronics manufacturing technology event, NEPCON China has long reflected the health of the country’s electronics production equipment and electronics manufacturing industry. Over three days, NEPCON China 2013 will present a comprehensive range of new technologies, products and solutions for the electronics man- ufacturing and SMT industries. The displays will include SMT technology and equipment, electronics manufac- turing and automation equipment, ESD and clean room devices, soldering equipment and materials, test and measurement machines, bar code equipment and materials, and elec- tronics manufacturing services. The expo will occupy a massive 38,000m2
with more than 500 exhibitors from 22 countries and regions. There will be more than 1,000 electronics produc- tion systems, test and measurement products, and components. Over 20,000 leading industry practitioners and buyers from various fields are expected to attend. Fuji, Hitachi, Juki, Samsung Techwin, Xunke, Nordson, BTU International, Indium, Agilent, Nordson Dage Electronics, Mirtec, TRI and other top suppliers of SMT, solder- ing and test/measurement equip ment and materials, are already confirmed exhibitors at the event. China’s elec- tronics manufacturing industry con- tinues to develop in leaps and bounds and the country has become the world’s undisputed electronics manu- facturing hub. Greater attention to production costs and efficiency by manufacturers is driving the industry
to keep pace with automation trends. Contact: Reed Exhibitions
China, 1-3 Xinyuan South Road, Chaoyang District, Beijing, Ping An International Finance Center A, Floor 15, China 100027 % +86-10- 5933 9346 fax: +86-10-5933 9333 E-mail:
inquiry@reedexpo.com.cn Web:
www.reedexpo.com.cn or
www.nepconchina.com
2013 ISSUE Jan/Feb March EDITORIAL
Assembly & Packaging Electronics West/MDM PP APEX PP
Test & Measurement Assembly New England PP
April/May SMT & Production SMT/Hybrid/PKG PP Nepcon China PP EDS PP
June July August
Components & Distribution Atlantic Design PP Test & Assembly
Semicon West/Intersolar PP
Production & Packaging Nepcon South China PP
September PCB & Test IPC Midwest PP PCB West PP IMAPS PP
PCB West PP IMAPS PP
October October
Nov/Dec Nov/Dec
SMT & Assembly SMTAI PP
SMT & Assembly SMTAI PP
Productronica PP Productronica PP
PP= Product Preview
Components & Distribution El t i W t/MDM PP
Components & Distribution Electronics West/MDM PP
Nepcon South China
Autotestcon IPC Midwest PCB West PP IMAPS SMTAI
PCB West PP IMAPS SMTAI
MDM Minneapolis Productronica
MDM Minneapolis Productronica Fabtech
Fabtech El t i W t/MDM
Electronics West/MDM 8/27 - 8/29
9/17 - 9/19 TBD
9/24 - 9/26 10/1 - 10/3
9/24 - 9/26 10/1 - 10/3
10/15 - 10/17 10/30 - 10/31 11/12 - 11/15
10/15 - 10/17 10/30 - 10/31 11/12 - 11/15
11/19 - 11/21 2/10 - 2/12 2014
11/19 - 11/21 2/10 - 2/12 2014
Shenzhen, China S
Schaumburg, IL Schaumburg, IL Santa Clara, CA Orlando, FL
g,
Santa Clara, CA Orlando, FL
Ft. Worth, TX Minneapolis, MN Munich Germany
Chicago, IL A h i CA
Chicago, IL Anaheim, CA
Ft. Worth, TX Minneapolis, MN Munich Germany
SHOW
EDITORIAl CAlENDAR DATE
LOCATION DesignCon
Electronics West/MDM APEX APEC
Assembly New England
SMT/Hybrid/PKG Nepcon China Del Mar Electronics EDS
Wire Processing Tech Eastec
Atlantic Design Semicon West/Intersolar
1/29 - 1/30 2/12 - 2/14 2/19 - 2/21
3/19 - 3/21 4/10 - 4/11
4/16 - 4/18 4/23 - 4/25 5/1 - 5/2 5/7 - 5/9 5/8 - 5/9
5/14 - 5/16 6/18 - 6/20 7/9 - 7/11
Santa Clara, CA Anaheim, CA San Diego, CA
Long Beach, CA Boston, MA
Nuremberg, Germany Shanghai, China San Diego, CA Las Vegas, NV Milwaukee, WI
W. Springfield, MA Philadelphia, PA San Francisco, CA
ector at UBM Electronics. “Design - Con is the largest annual meeting of board designers, and is the best face- to-face opportunity to scale know- how about chip, system and package design challenges.” DesignCon’s opening day key -
note address will be delivered by Bill Swift, Vice President of Engineering at Cisco Systems, who leads silicon development engineering for the service provider, enterprise and high-end switching-based products. Jonah Alben, Senior Vice President of Engineering at NVIDIA, will keynote on the second day, Tuesday, Jan. 29. Mr. Alben currently leads the development of next-generation
GPU architectures. On Wednesday’s keynote address will be given by Mike Santori, Business and Technol - ogy Fellow at National Instru ments. DesignCon 2013 will present
more than 100 tutorials and techni- cal paper sessions focused on the per- vasive nature of signal integrity at all levels of electronic design. Consequently, all presentations will be categorized under one of 14 con- ference tracks. In addition, the expo
will have more than 130 exhibitors. Contact: UBM, 303 2nd Street,
Suite 900, South Tower,
San Francisco, CA 94107 % 415-947-6000 Web:
www.designcon.com
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
Dec. 4-6, SMTA Counterfeit Parts Symposium. *Crowne Plaza Anahein Resort, Anaheim, CA. Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
www.smta.org or
www.smta.org/counterfeit
Dec. 5-6, Printed Electronics & Photovoltaics USA 2012. *. Santa Clara, CA. Web:
www.PrintedElectronicsUSA.com
Jan. 6-7, Annual Storage Visions Conference. *Riviera Hoten Convention Center, Las Vegas, NV. Contact: Entertainment Storage Alliance Web:
www.EntertainmentStorage.Org
Jan. 8-11, 2013, Consumer Electronics Show. *Las Vegas Convention Center,
Las Vegas Hilton, Renaissance Las Vegas, The Venetian Tower Suites, Las Vegas, NV. Contact: Consumer Electronics Association, 2500 Wilson Blvd., Arlington, VA 22201-3834 % 866-233-7968 or 301-631-3983 fax: 703-907-7601 E-mail:
CESInfo@CE.org Web:
www.CE.org or
www.cesweb.org
Jan. 22-23, 2013, IMAPS Technical Workshop-Wire Bonding. *Radisson Hotel
San Jose Airport, San Jose, CA. Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002 % 202-548-4001 fax: 202-548-6115 Web:
www.imaps.org
Jan. 29-31, 2013, DesignCon 2013. *Santa Clara Convention Center, Santa Clara, CA. Contact: UBM, 303 2nd Street, Suite 900, South Tower, San Francisco, CA 94107 % 415-947-6000 Web:
www.designcon.com
Feb. 11-14, 2013, MD&M West. *Anaheim Convention Center, Anaheim, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 %310-996-9495 or
vu.nguyen@
ubm.com Web: http:
www.canontradeshows.com/expo/west13/
Feb. 19-21, 2013, IPC APEX. *San Diego Convention Center, San Diego, CA. Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web:
www.ipc.org or
www.IPCAPEXEXPO.org
Feb. 26-28, 2013, Houstex. *George R. Brown Convention Center, Houston, TX. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.houstexonline.com
Feb. 27-28, 2013, Texas Design-2-Part Show. *Gaylord Texas Convention Center, Grapevine, TX. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Mar. 11-14, 2013, IMAPS 9th International Device Packaging Conference
and Exposition. *Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002 % 202-548-4001 fax: 202-548-6115 Web:
www.imaps.org
Mar. 19-21, 2013, AERODEF Manufacturing. *Long Beach Convention Center, Long Beach, CA. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.aerodefevent.com
Apr. 10-11, Electronics New England.*Boston Convention and Exhibit Ctr., Boston, MA Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 %310-996-9495 or
vu.nguyen@
ubm.com Web: http:
www.electronics-NE.com
Apr. 16-17, 2013, Micromanufacturing Conference and Exhibits. *Hilton Minneapolis, Minneapolis, MN. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.sme.org/micro
May 14-16, EASTEC. *Eastern States Exposition, West Springfield, MA. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.easteconline.com
May 20-23, 2013, IPC Electronic System Technologies Conference. *New Tropicana Hotel, Las Vegas, NV. Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web:
www.ipc.org or
www.IPC.org/ESTC
December, 2012
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96