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www.us-tech.com Machine Vision: Wire Bond Inspection
Carlsbad, CA — Machine Vision Products (MVP) has a proven track record of success with a broad range of applications across both SMT and Microelectronics, covering commer- cial, medical and defense based devices. The Ultra 850G is Configured to
1µm pixel resolution and provides: inspection of wire bond; high accura- cy die placement metrology; surface finish inspection for, foreign objects and scratches. In addition, the unit has a host
of other applications support using the same basic configuration. Configurable down to 1µm pixel
Ultra 850G inspection system.
size the 850G can also inspect for: packaging and BGA inspection; epoxy underfill; glues and sealants; 3D paste; material dimensional metrology.
Because all development is per-
formed in-house, the company’s sup- port structure is second to none. The company is taking multiple steps to continue to provide the overall lowest
cost of ownership. Contact: Machine Vision
Products, Inc., 5940 Darwin Ct., Carlsbad, CA 92008 % 800-260-4687 or 760-438-1138 fax: 760-438-0660 E-mail:
sales@visionpro.com Web:
www.machinevisionproducts.com
April, 2012
Nordson MARCH: Plasma Cleaning Systems
Concord, CA — Nordson MARCH’s advanced architecture AP-1000 plas- ma system is designed to be a high- performance plasma systems for cleaning and treating electronic com- ponents, small circuit boards, and medical, and life science devices. The plasma system is well suit-
ed for large production facilities, lab- oratories, universities, and R & D
Plasma cleaning system.
centers that require the most advanced plasma systems available. Available treatment solutions,
such as pre-flip chip underfill, pre- wire bonding, wafer cleaning, des- cum, encapsulation and molding. The plasma systems are designed to provide high throughput rates and uniformity of treatment while main- taining a small equipment footprint
and low cost of ownership. Contact: Nordson March, 2470-
A Bstes Ave. Concord, CA 94520 % 925-827-1240
Web:
www.nordsonmarch.com
Universal: New Cost Effective Platform
Conklin, NY — Universal Instru - ments has introduced the Genesis GX-37D, designed to give customers the highest level of cost-effective per- formance in a flexible module that readily adapts to their unique requirements. By placing chips at high speed and extending through extreme odd-form component place- ment, the GX-37D is an effective sin- gle-machine solution, line-balancer
or powerful end-of-line solution. Contact: Universal Instruments
Corp., 33 Broome Corporate See us at NEPCON China, Stand 1F10
Parkway, Conklin, NY 13748 % 607-779-5364 fax: 607-772-1878 E-mail:
zopff@uic.com Web:
www.uic.com
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