April, 2012
www.us-tech.com
Page 67
CyberOptics Shows Newest AOI and SPI Systems
Minneapolis, MN — CyberOptics Corporation is introducing the QX100™ tabletop AOI system, equipped with AI2 next-generation image analysis software along with a preview of its latest in-line AOI and
on QX100 are 100 percent compatible with in-line systems. The company is also showing its newest 3D SPI sys- tem, the SE500ULTRA™, designed with an all-new, ultra-fast sensor setting a new benchmark for SPI inspection speed. The sensor com- bined with the company’s unusual “all-in-one” scan algorithm positions the SPI system to be 30 percent faster than its predecessor SPI sys- tems with zero compromise on meas- urement accuracy and repeatability. It also includes a dual illumination
sensor option to further improve repeatability and reproducibility on the very smallest of paste deposits. A sneak preview of the QX600™
system, the company’s next in-line AOI innovation, also is being dis- played. The QX600 is designed with a new Strobe Inspection Module (SIM) with improved illumination using LED lighting and higher reso- lution of 12µm, enabling improved solder joint and gold finger inspec- tion while significantly reducing reflection and shadow effects.
Also on display is a prototype
version of the QX100i™ system, an entry-level inline AOI aimed at pro- viding a cost-effective inspection solution.
Contact: CyberOptics Corp., 5900 Golden Hills Drive,
Minneapolis, MN 55416 % 763-542-5000 fax: 763-542-5100 E-mail:
info@cyberoptics.com Web:
www.cyberoptics.com
See at Nepcon China Booth #1G55.
QX-100 AOI system.
SPI systems. The company’s unusual value-add initiatives such as one- step SPI/AOI programming, AOI-SPI correlation analysis and printer closed loop feedback capability also will be featured. According to the company, the QX100 redefines table- top inspection by combining the per- formance of an in-line inspection sys- tem with the flexibility of a tabletop system. The system uses the compa- ny’s unusual image acquisition tech- nology, the Strobed Inspection Module (SIM), and is capable of inspecting component sizes down to 01005. The sleek unit is powered by AI2(Autonomous Image Interpreta - tion), a patented next-generation image analysis technique that pro- vides superior defect detection capa- bilities, lowest false call rates and improved clarity of defect identifica- tion. With AI2 technology, program- ming is faster — with a dramatic 90 percent reduction in examples, and simpler, with full support for unsu- pervised and semi-automatic model training. A single workflow setup makes it a suitable choice for high- mix environments. Programs created
New Horizons in Bond Testing
The Nordson DAGE 4000Plus is the most advanced bondtester on the market, representing the industry standard in bond testing.
Data Integrity
Developed by the world leader in bond testing technology, the 4000Plus offers unsurpassed accuracy and repeatability of data providing complete confidence in results.
Huge Online Knowledge Center.
Every special feature, every news article, and every new product release printed in the past three years is search-ready and screen- eager through our new online knowledge center.
A wealth of information.
www.us-tech.com.
Hot Bump/Pin Pull on the 4000Plus
A unique patent protected technique for attaching a probe to solder bumps or paste and performing a pull test in accordance with the IPC standard IPC9708 pad cratering testing for surface mount and printed board assemblies.
software for easy on screen profiling and control. A selection of standard probe sizes are available with custom tips available on request.
Learn more at
www.nordsondage.com/4000Plus
www.nordsondage.com |
usglobalsales@nordsondage.com See us at NEPCON China, Stand 1G85
The 4000Plus HBP application is achieved by simply selecting a specialized load cartridge which can be programmed to apply a temperature-time reflow profile to individual bumps/bonds using a probe. Pre-heating, soak, rate of rise, liquidus and cooling are all integrated into the 4000Plus Paragon™
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