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Prototron Circuits Quickturn PCBs Since 1987
America’s Board ShopTM
RoHS 5
www.us-tech.com
April, 2012
Finetech: Professional Rework Systems
Berlin, Germany — Finetech is pre- senting two professional rework sys- tems — the FINEPLACER® core plus and the FINEPLACER pico rs. The FINEPLACER core plus is a com- pact, yet versatile rework system that offers a level of profes- sionalism that exceeds its attractive price. The system offers proven rework technolo- gy for a wide spectrum of SMD components, ranging in size from 0201 to 70 x 70mm. This compact rework sta-
tion is based on the company’s proven technology, integrating the complete rework cycle into an efficient design, without diminishing functionality. The system is at home in produc- tion environments where process reproducibility is cru- cial. The large area under- board heater for PCBs supports board sizes of up to 400 x 310mm. The FINEPLACER pico rs is an
The system has a placement
accuracy of better than 5µm, high- efficiency board heating, closed-loop force control as well as automated top heater calibration. The system- to-system process transfer capability
FINEPLACER pico rs rework system.
enhanced hot air rework station for assembly and rework of all types of SMD components. The system is excellent for professional mobile device rework in challenging high- density environments. The system provides Integrated
Prototron.com See us at Electronics New England, Booth 1033
Process Management (IPM) with syn- chronized control of all process mod- ules and their related parameters: top and bottom (pre-)heating and cooling, temperature, time, power, flow, light and vacuum. Process gas can be seam- lessly integrated into the reflow process for significantly improved sol- dering results.
allows worldwide profile allocation with highly reproducible results on all of the company’s modular rework systems. The application range includes the whole rework cycle for 01005, 0201, Package-on-Package (PoP), µBGA/µCSP, leadless compo- nents (QFN/MLF), shielded SMD or reworkable underfilled components,
among others. Contact: Finetech, 8380 S.
Kyrene, Ste. 110, Tempe, AZ 85284 % 480-893-1630 fax: 480-893-1632
E-mail:
adrienne@finetechusa.com Web:
www.finetechusa.com
See at Nepcon China Booth #1A81.
F+K: Wire Bonders Outside the Mainstream
Munich, Germany — F and K Delvotec’s new wire bonder, the G5- XL had been introduced at produc- tronica 2011 and is at the heart of the company’s diversification strate- gy away from a pure semiconductor business and towards other market segments such as PV manufacturing. The primary targets are solar cells and battery modules for e-vehi-
meter, allowing it to bond large solar cell panels or entire battery modules in a single pass. This greatly simpli- fies the module or panel design. This year, the new bonder has
already found favor with several customers from the solar cell and battery module market segments. Orders have pushed the company’s backlog well into mid-year. Contact:
Large-panel bonder.
cles, and the company has developed a purpose-built wire bonder with an extremely large working area. The new G5-XL bonder, had been intro- duced to great acclaim at productron- ica in Munich and has a gigantic working area of almost one square
F & K Delvotec Inc., 27182 Burbank
Avenue, Foothill Ranch, CA 92610 % 949-595-2200 fax: 949-595-2207 E-mail:
info@fkdelvotecusa.com Web:
www.fkdelvotec.com
See at Nepcon China Booth #1H37.
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