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www.us-tech.com
April, 2012 Interplex Intros SMT Press-Fit Pins
East Providence, RI — Interplex En - gin eered Products has introduced a new patent-pending Surface Mount Technology (SMT) Card-Edge Con - nec tor System based on the compa- ny’s press-fit technology. The new product is a discrete pick-and-place SMT component that creates a sol- derless edge card interconnection for daughter board applications. These SMT card-edge contacts can be placed on a daughter card using standard high-speed pick-and-place surface mount equipment. The Surface Mount Device
(SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution. The SMT Card Edge Contact
System is designed for standard 1.6mm (0.062-in.) thick PCBs but is also compatible with other PCB thicknesses. The center minimum PCB spacing is 3.2mm (0.126-in.). The product incorporates the compa- ny’s proven and tested 0.64mm
press-fit technology. It is packaged in a 16 x 4mm pitch EIA tape on a 13- in. diameter plastic reel for compati- bility with standard high-speed sur-
Press-fit contacts for daughterboard.
face mount pick-and-place equip- ment. It is suitable for high-conduc- tivity material, able to carry up to
15amps per contact. Contact: Interplex Industries,
14-34 110 St., Suite 301, College Point, NY 11356 % 718-961-6212 Web:
www.interplex.com
RFMW: Diamond Substrate SMT Terminations
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Introducing the NEW SX-100 Sodr-X-Tractor, the latest evolution in in-line desoldering handpieces. Spend more time working and less time maintaining.
Quick Change Collection Feature
San Jose, CA — RFMW has intro- duced the CT0402D, a 10W termina- tion packaged on a standard 0402 size diamond substrate. The excellent heat dissipative properties of CVD diamond substrates allow high power termina- tions and resistors in very small pack- ages. Operating frequencies are from DC to 8GHz. CVD diamond thermal conductivities are about 3-4 times that of copper at 1000-1800 W/m-K and far beyond Beryllia and Aluminum Nitride making them especially suit- able for high reliability and space applications or where printed circuit space is at a premium. The company supports the EMC Technology dia- mond substrate products as well as
Diamond substrate terminations.
BeO and AlN devices. Contact: RFMW, Ltd., 90 Great
Oaks Blvd., #107, San Jose, CA 95119 % 877-367-7369 or 408-414-1450 E-mail:
info@rfmw.com Web:
www.rfmw.com
Save space, time and money.
Shuttle VLM: for intelligent, dynamic, high density storage in a compact footprint.
Quick Change Heater
Multiple Collection Options
1-877-882-7223 No-Clog Tip
www.paceworldwide.com/SX100
Call for Information: 800-639-5805
High Density Storage: Maximum storage density in up to 85 % less fl oor space. Automated Delivery: Deliver all stored goods to increase productivity by up to 2/3.
Kardex Remstar is one of the world‘s leading providers of automated storage and materials handling solutions.
www.kardexremstar.com Solutions and systems for soldering, rework and repair of electronics
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