April, 2012
www.us-tech.com
Page 69 Welding Technology from LPKF
Tualatin, OR — LPKF is highlighting its UV laser systems, including the MicroLine 1120 S and 6120 S which are designed for depaneling populat- ed PCBs and are suitable for cutting break-out tabs and complex contours with the highest accuracy. The UV laser demonstrates its
superiority over conventional cutting systems when handling rigid and flexible substrates in particular. The laser is capable of cutting board out- lines, adjacent to delicate compo- nents and tracks, without causing any of the mechanical stress associ- ated with routers or dicing saws. This allows for small subassemblies with much higher densities to be realized, with components right up to the edge of the printed circuit board. Also being highlighted is the
Henkel Bows High Tg, Reworkable Underfill
Irvine, CA —Expanding on its portfo- lio of advanced underfill materials, Henkel has developed LOCTITE UF3810, a new underfill technology that provides extremely high reliabil- ity while also allowing for easier reworkability as compared to previ- ous generation products. Designed to deliver superior
performance and ease-of-use, the new underfill addresses many of the complex requirements associated with today’s high value devices, but does so in a formulation that has excellent processability. The material is halogen-free, completely rework-
MicroLine 1120 P and 6120 P series which are UV laser systems designed for processing bare rigid and flexible PCB circuit boards. The UV laser cuts, drills, engraves and ablates with the tightest tolerances on a wide variety of materials making it the most versatile and inexpensive UV laser on the market today. It has the ability to cleanly cut even the most complicated patterns with min- imal stress to the substrate, allowing for more circuits on a single panel and eliminating the limitations of tooling with the use of an integrated vacuum table. The MicroLine P mod- els are especially suited for high-mix,
flexible manufacturing environ- ments.
The company is also highlight-
ing its laser plastic welding systems. Laser plastic welding has been around for decades, but with an ever increasing demand for smaller, more intricate devices, laser plastic weld- ing is growing to become a major player in plastics joining methods. Primarily found in the automotive, medical and consumer electronics industries, LPKF laser welding sys- tems are used for a variety of appli- cations from small electronics hous- ings, to highly complex and intricate microfluidic devices, and even exteri-
or automotive lighting. The LPKF laser plastic welding system family is comprised of three main machines: the LQ Vario, LQ Power and TwinWeld3D, and with nearly unlimited customization options these machines can be fitted to suit the needs of the most demanding
plastics joining projects. Contact: LPKF Laser &
Electronics, 12555 SW Leveton Dr., Tualatin, OR 97062 % 800-345-5753 or 503-454-4200 fax: 503-682-7151 E-mail:
info@lpkfusa.com Web:
www.lpkfusa.com
See at Nepcon China Booth #1B111.
Halogen-free underfill.
able and has a high glass transition (Tg) temperature of 100°C, thereby delivering robust thermal cycling reliability for next-generation wafer- level CSP (WLCSP) and PoP devices. Well suited for today’s handheld
communication and entertainment applications, the material delivers excellent drop and shock protection and improved thermal cycling relia- bility for fine-pitch (0.5mm pitch and below) area array devices. In addition to superior performance versus alter- native reworkable underfills, LOC- TITE UF3810 also provides ease-of- use that adds flexibility to its process. The material flows fast and underfills at room temperature and cures quickly at a moderate 130°C which, in addition to its halogen-free status, adds to the material’s sus- tainability through reduced energy
consumption requirements. Contact: Henkel Corp., 1400
Jamboree Rd., , Irvine, CA 92606 % 714-368-8000 949-789-2500
E-mail:
doug.dixon@us.henkel.com Web:
www.henkel.com/electronics
See at Nepcon China Booth #1H15.
See us at NEPCON China, Stand 1C65
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