news digest ♦ RF Electronics
maximum talk-time and thermal efficiency critical for smartphone applications.
The TRITIUM Duo also employs a wafer level packaging technique to provide hermetic filter encapsulation for improved performance and a reduced size. In addition, the modules integrate high-performance BAW and SAW duplexer capabilities.
TriQuint will showcase its mobile device platform solutions, including the new TRITIUM Duo family, at the GSMA Mobile World Congress in Barcelona, Spain, between February 27 and March 1, 2012.
said Shane Smith, Vice President of Global Marketing for Mobile Devices. “Our 2G QUANTUM Tx module has already made significant inroads in the GSM market. Our new 3G/4G QUANTUM Tx module pairs with our new TRITIUM Duo family of dual-band PA-duplexer modules to create the industry’s smallest, high-performance RF solution for global 3G/4G wireless devices.”
Leading mobile handset manufacturers Samsung, Huawei and ZTE have selected TriQuint’s new QUANTUM Tx modules. TriQuint has seen success with previous generations of its QUANTUM Tx modules; to date, more than 150 million units have shipped.
“We expect to ship more than 100 million QUANTUM Tx modules in the next 18 months alone, making it one of the highest volume product lines in our factory,” Smith added.
The TRITIUM Duo is currently sampling, with volume production is planned in June.
TriQuint speeds up the smallest phones
The firm’s devices incorporating gallium arsenide HBTs, deliver design flexibility for 2G, 3G and 4G mobile devices
TriQuint Semiconductor is now offering two QUANTUM Tx modules that are 40% smaller than the previous generation.
These transmit modules integrate TriQuint’s new ultra-small GSM core, and enable more flexibility for smartphones, feature phones and low-cost voice- only phones.
TriQuint increased manufacturing capacity by 40 percent in 2011 to support customer demand for its growing mobile device portfolio.
Shipping in volume since mid-2011, TriQuint’s 2G (GSM) QUANTUM Tx module, TQM6M4068, offers phone designers full GaAs HBT performance and a small size to enable flexible designs. At 5 x 6 x 1 mm, the TQM6M4068 is one of the industry’s smallest Tx modules and has won “Best Product” in the 2011 EDN China Innovation Award program for the communications and networks front-end category.
“Design innovations have enabled cost and size breakthroughs without compromising performance,”
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www.compoundsemiconductor.net March 2012
Approved for MediaTek’s chipset reference design, the new product has been chosen for many new 2G phone platforms. “Close to 1.5 billion GSM
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