news digest ♦ RF Electronics
low quiescent currents. The ALT6705, AWT6621, AWT6624, and AWC6323 power amplifiers deliver efficiency to extend battery life in handsets, smart phones, tablets, netbooks, and notebooks.
The company’s HELP4 PAs offer an average current consumption reduction of 30%, compared with previous generation PAs.
Both the HELP4 and HELP3E devices have three mode states to achieve exceptional power-added efficiencies at low-range and mid-range output power levels and a quiescent current of 4 mA or less.
Both families of devices are highly integrated and are claimed to have best-in-class linearity at maximum output power and both feature internal voltage regulation.
The HELP4 PAs have an integrated “daisy chainable” directional RF coupler with 20dB directivity.
The HELP3E modules have two independent PAs in a single package and an integrated RF coupler.
The HELP4 PAs come in a 3 mm by 3 mm package while the HELP3E PAs have a 3 mm by 5 mm footprint.
“Today’s applications and devices require improved efficiency at high power,” says Thomas J. Richter, senior marketing director of front-end solutions at Skyworks. “Skyworks’ new family of SkyHi amplifiers and front-end modules deliver close to 50 percent power-added efficiency, and offer a path to even higher efficiency when utilised in an envelope tracking system.”
According to Ericsson, a global provider of telecommunications equipment and services, mobile broadband connections, which provide the means to connect to the Internet and download data or other content, are exploding. It estimates that there were more than 500 million mobile broadband subscribers globally in 2010 with subscriptions expected to grow to more than 2.5 billion subscribers in 2014 ;a compounded annual growth rate of 44 percent.
The SKY77619 (Bands I, II, III, IV, V and VIII) is a multimode, multiband power amplifier module (PAM) that supports 2.5G/3G and 4G handsets and operate efficiently in GSM, EGPRS, EDGE, WCDMA and LTE modes. The InGaP/GaAs die are mounted on a multilayer laminate substrate and the assembly encapsulated in plastic overmold.
SkyHi family raises the bar for power added efficiency
A new range of power amplifiers are claimed to achieve performance breakthrough in support of data intensive mobile platforms
Skyworks Solutions is marketing several new 3G and 4G high-efficiency front-end solutions, collectively known as “SkyHi”, for smartphones, tablets and wireless data modules.
All modules in the series incorporate Skyworks’ GaAs/InGaP die, GaAs MMIC and/or InGaP HBT technology.
Skyworks says its SkyHi products extend battery life, reducing the radio footprint, and simplify calibration for manufacturers.
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www.compoundsemiconductor.net March 2012
The SKY77733 (Bands XIII/XIV) and SKY77737 (Bands XII/XVII) are fully matched surface mount modules PAMs developed for LTE applications. The single GaAs MMICs in both devices contain all active circuitry in the modules, including the PA, input, and interstage matching.
The SKY77761 is a PAM that is a fully matched 10- pad surface mount module developed for WCDMA applications. This module also has a single GaAs MMIC similar to the SKY77733 and SKY77737 and also incorporates Skyworks’ InGaP HBT technology.
The SKY77751 and SKY77752 are dual band power amplifiers supporting either Bands I and VIII or II and V. They come in a 3 x 4 mm package and have either a single RF input or dual RF input for CDMA and WCDMA applications.
The SKY77762, SKY77764, SKY77765 and SKY77768 are PAMs supporting Band I, II, IV, V and VIII, respectively, developed for CDMA, WCDMA and LTE applications.
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