LEDs ♦ news digest
II-XL configuration offers an outstanding reactor capacity as high as 19 x 4 inch, which represents a capacity increase of 46% compared to the original CRIUS II. Aixtron reckons this gives it the highest throughput and lowest cost of ownership in the whole LED industry.
Optogan takes lean to the extreme with 500W COB LED platform
The firm’s X10 offers a modular approach for luminaire designs from 1,100 lumens to 55,000 lumens and can be used in a variety of different shapes and sizes
Optogan’s new X10 Chip-on-Board module (COB) is based on the vision of scaleability and lean processing for luminaire manufacturing.
The multinational engineering team achieved the requested target to develop a unified COB module portfolio for simplified application, handling, increased performance and lifetime at a universal level.
“X10 represents Optogan’s new flagship, offering modular solutions, economical and simple to use, for that additional degree of freedom in lighting design. Coupled with state of the art module efficiency exceeding 100 lm/W, the X10 provides our clients the maximum possible variety in steps of 10W reaching up to 500W. The positive feedback from our key customers confirms, that our latest development is covering the missing white spot in LED landscape”, says Markus Zeiler General Manager Global Sales & Marketing at Optogan GmbH in Germany.
The company says it is currently ramping up pre- series production of the X10.
The modules can be used in applications for LED- retrofits, downlights, industrial and street lighting as well as flood and stage lights as they come in various sizes and forms.
The X10 COB-block consists of 50 segments which can easily be divided into LED elements of smaller sizes and power, and each of these can be used in separate light fittings. The smallest segment of Optogan´s “single X10” consists of a 1cm² ceramic board and consumes 10 W (1 A, 10 V), with efficacy levels currently exceeding 100 lm/W.
The product’s ceramic base and the materials used are optimised for long life performance. The new technology incorporates smart binning and uses the firm’s lean in-house production.
Optogan says the COB was designed for direct mounting on heat sinks and offers a smaller footprint than conventional solutions. The firm is also offering an X10 system specific accessory, which is a universal connector providing both electrical and mechanical interfaces for assembly and optics.
Toyoda Gosei less than impressed with Formosa Epitaxy
Another lawsuit alleges that Forepi is infringing Toyoda Gosei’s patents regarding gallium nitride- based LED chips. Toyoda Gosei is seeking damages and an injunction against a plurality of Forepi LED products
On February 24, 2012, Toyoda Gosei Co., Ltd. filed a patent infringement lawsuit in Taoyuan District Court in Taiwan against Formosa Epitaxy (Forepi), a Taiwanese LED chip manufacturer.
Prior to this, Toyoda Gosei filed a patent infringement lawsuit in the United States District Court, Northern District of California on February 21, 2012 against Forepi’s infringement of its LED chip patents.
Japanese head-quartered Toyoda Gosei, says it was one of the first to develop LED chips and has also obtained a number of LED-related intellectual property rights worldwide.
A spokesperson from Toyoda Gosei said, “We have respected others’ and our own intellectual
March 2012
www.compoundsemiconductor.net 61
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136