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RF Electronics ♦ news digest


RF power management to accelerate with RFMD


The company is developing average power tracking- (APT-) and envelope tracking- (ET-) based solutions for power amplifiers using compound semiconductor technology


RFMD has shipped tens of millions of power management integrated circuits (PMICs), mostly within the RF Configurable Power Core based on in its PowerSmart power platform.


The firm has also sold hundreds of millions of PowerStar PAs and transmit modules which have integrated power control.


RFMD forecasts the combination of envelope tracking (ET-) technology and its GaAs device expertise will be a disruptive combination that raises the bar significantly in RF performance.


Eric Creviston, president of RFMD’s Cellular Products Group said, “RFMD is at the forefront of technology development in RF power management, and we are enthusiastic about the deployment of APT- and ET-based solutions. We believe the importance of power management technologies such as average power tracking and envelope tracking will continue to expand in smartphones, enabling RFMD to leverage our combined leadership in power amplifiers and RF power management and increase our RF content opportunity.”


GaAs TRITIUM Duo family is the tiniest for dual-band power


TriQuint says it’s gallium arsenide based amplifiers offer mix-and-match two-band combinations. This gives mobile device manufacturers a flexible, high- performance platform that speeds up time to market


TriQuint’s new TRITIUM Duo family combines two band-specific power amplifiers (PAs) and two duplexers in a single compact module, effectively replacing up to twelve discrete components.


“We’ve powered the world’s top smartphones with over a half billion of our single-band TRITIUM modules, and now the TRITIUM Duo is being evaluated by customers for use in next generation smartphones,” said Ralph Quinsey, president and chief executive officer of TriQuint. “Our broad technology portfolio has enabled us to integrate two commonly used bands in one small footprint. Not only have we simplified the RF front-end for phone designers, we have also increased performance and flexibility.”


The TRITIUM Duo family shares a common 6 x 4.5mm footprint, giving designers the flexibility to support multi-band, multi-mode operations across multiple platforms. Mobile device manufacturers can capitalise on the large size reductions to include more features or larger batteries in thinner, lighter form factors with all the performance needed for CDMA, 3G, and 4G networks.


At about 50 mm2,, roughlyhalf the footprint of a comparable discrete solution, they offer improved manufacturing and supply chain efficiency. Optimised for each of its two bands, no switching is required after amplification, unlike configurable architectures.


The new dual-band TRITIUM Duo implements proprietary TriQuint CuFlip technology to replace wire bonds with copper bumps; this saves board real estate and enables superior system performance by eliminating noise-radiating wires.


The copper bumps also dissipate heat better than traditional interconnect techniques. The integrated Flip Chip BiHEMT power amplifier die achieves industry leading current consumption to provide


March 2012 www.compoundsemiconductor.net 93


The company says it is the smallest dual-band PA duplexer (PAD) for global 3G and 4G smartphones.


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