This page contains a Flash digital edition of a book.
October 3 2013 Hyatt Regency • Downtown Boston Register now at www.electronics-sourcinglive.com


GET THE FACTS ON POWER FILTERING


Clive Youngs of Holy Stone Enterprise offers advice on the latestmicro leadframe chip carrier technology.


Historically, filtering in power applications such as DC­DC converters, switchmode power supplies and rectifiers has been achieved using aluminiumelectrolytic or tantalumcapacitors, due to their high capacitance value (CV) capabilities. Recently,micro leadframe chip carriers (MLCC) have becomemore common,with their inherent reliability and non polar construction.


With lower equivalent series resistance (ESR) and equivalent series


inductance (ESL),MLCCs require lower capacitance values to achieve the lower noise levels required. As board space is reduced in power applications, it has become problematic to achieve the high CV values required for filter capacitors. In addition, the push for higher switching frequencies in switchmode power supplies requires even lower levels of ESL to smooth the ripple effects.MLCCs are ideal for these applicationswith their small size, lowESR and ESL.


Stacked chip capacitors are designed to offer the electrical


advantages ofMLCCs,with high CV values achieved by assembling up to five chip capacitors togetherwith a dual in­line lead frame. These


types of components have been used successfully formany years in the power industry, however, great caremust be taken in handling. Thanks to their size, if not handled correctly, they can be susceptible tomechanical and thermal damage.


Today,MLCC dielectricmaterials and processing technology have


resulted in capacitance values in the 50 to 250V DC range,whichwas previously only achievable using aluminiumelectrolytic or stacked chip technology.


Up to 10µF in X7R,with a rated voltage of 100V DC is nowavailable


in a single 2220 sized chip. At 50V DC, the chip size for the same 10µF capacitance value can be reduced to 1210 size. Previously these CV valueswould have required up to three single chips, assembled into a stack chip. By using a single surfacemount capacitor, however, even lower ESL values are said to be possible in high frequency switch mode power supplies.


www.holystonecaps.com


Search the Web’s largest aggregation of genuine parts from authorized sources.


Find them at www.ECIAauthorized.com 54 |May/June 2013 www.electronics-sourcing.com


Holy Stone FSC Stacked Chip Series


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68