Telecoms ♦ news digest
optoelectronic modules and subsystems for bandwidth intensive high speed communications networks.
These small form factor products are designed to meet the requirements of high port density 100G coherent systems and to scale to 200G and 400G applications using higher order modulation schemes.
NeoPhotonics supplies Narrow Linewidth Tuneable Lasers (NLW-TL) and Intradyne Coherent Receivers (ICR), which are key components in the 100G Coherent Transport systems currently being deployed in growing numbers around the world.
NeoPhotonics has now added new small form factor versions to its current optical components for coherent systems. The first new product is a narrow-linewidth, micro-Integrable Tuneable Laser Assembly (micro-ITLA), which is designed to reduce the footprint by more than a factor of three and to reduce power consumption compared to current generation ITLAs.
What’s more, NeoPhotonics’ micro-ITLA is designed to support the high optical output power and the narrow linewidth required for next generation coherent network architectures. The second product is a Small Form Factor Intradyne Coherent Receiver (SFF-ICR), which is less than half of the size of currently shipping ICRs.
The SFF-ICR has the option of an integrated VOA on the signal path and a monitor photodiode (MPD) to simplify board level integration. This versatile device is well-suited for both single incoming channel and multiple incoming channel applications.
“Photonic Integration has played a major role in enabling the current generation of coherent systems which are now transforming the optical communications landscape, and we are proud of the contribution NeoPhotonics has made to this sea change,” says Tim Jenks, Chairman and CEO of NeoPhotonics.
“As exemplified by these new products, we are utilizing our Photonic Integration technology to bring our customers the benefits of reduced size, reduced power consumption and higher levels of integration and performance,” continues Jenks.
Inphi appoints Nicholas Brathwaite to its Board
The indium phosphide (InP) provider of high- speed, mixed signal semiconductor solutions for the communications and computing markets has a new person on board
Inphi Corporation has announced that Nicholas Brathwaite has joined its Board of Directors.
“We are extremely pleased to welcome Nicholas to Inphi’s Board of Directors,” says Ford Tamer, Inphi’s president and CEO. “We are excited about his in-depth knowledge and wealth of expertise in driving innovation for high-tech, global companies.”
Brathwaite is a founding Partner of Riverwood Capital, a growth equity, middle market technology investment firm with investments in Asia, Latin America and the United States. He has also been involved with semiconductor companies, hardware development and electronic services (including manufacturing) since 1986.
Brathwaite served as the CEO of Aptina Imaging Corporation for approximately two years and is currently its Chairman of the Board.
Prior to Aptina, he joined Flextronics International Ltd. in 1995 as its Vice President of Technology and then from 2000 to 2007 served as its Chief Technology Officer. Flextronics acquired nChip, where he then held the position of Vice President and General Manager of operations from 1992 to 1996. Brathwaite also spent six years with Intel Corporation in various engineering management positions in technology development and manufacturing.
Brathwaite has served as a director of Power Integrations since January 2000 and as a member of the board of Lighting Science Group since April 2011. Nicholas Brathwaite also served as a member of the board of directors of Tessera Technologies, Inc., from February 2008 until May 2011 and Photon Dynamics, Inc. prior to its acquisition in 2008.
Brathwaite received a B.S. in Applied Chemistry from McMaster University, and an M.S. in Polymer Science & Engineering from University of Waterloo. He has also completed the Wharton Executive Education Training Program on Corporate Governance.
Infinera InP devices expand TeliaSonera International Carrier
The firm has accomplished this with its indium phosphide (InP) based Super-Channel SD-FEC
Infinera says it has the ability to double capacity on a key link in TeliaSonera International Carrier’s (TSIC) North America terrestrial network using the world’s first super-
October 2013
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