news digest ♦ Power Electronics
helps minimise system downtime and improve serviceability. Throughput is optimised via EVG’s latest Computer Integrated Manufacturing (CIM) Framework software platform and unmatched process control.
EVG currently has more than 100 customers implementing its proprietary OmniSpray technology, which is also integrated into the new EVG150 resist processing platform. The firm’s OmniSpray technology specifically allows the conformal coating of high topography surfaces via its proprietary ultrasonic nozzle.
Spray coating technology is ideally suited for ultra-thin, fragile or perforated wafers. In addition, according to EVG, the implementation of OmniSpray coating can result in a greater than 80 percent reduction in material consumption compared to traditional spin coating.
Another available option for the EVG150 platform is EVG’s NanoSpray technology, which is an enhanced, patented coating technique that can coat surfaces with vertical sidewall angles thus, for example, enabling conformal coating of through-silicon vias (TSVs) with polymer liners and photoresist.
The modular EVG150 automated resist processing platform is available immediately for demonstration and evaluation.
Ultra Tec reveals module for improved electronic packaging
A new hardware and software development enhances digital sample preparation system for the decapsulation, thinning and polishing of compound semiconductor packaged and wafer-level devices
Ultra Tec Manufacturing, has announced the availability of a new End-point Detection Module for the ASAP-1 IPS Selected Area Preparation System.
The End-point Detection Module is a hardware and software enhancement (patent pending) for the ASAP-1 IPS that provides the capability to quantify and act upon the capacitive and/or resistive
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www.compoundsemiconductor.net October 2012
An integrated circuit on a graphics board being prepared on the ASAP-1 IPS in End-point Detection Mode
Controlled microsurgery, with interactive end- pointing, opens the door for improved resolution with SQUID Microscopy, INSB thermography (Lock- In), Thermal Laser Stimulus and similar techniques without fully exposing the die topside or by stopping a few microns before target on silicon from the backside.
ASAP-1 IPS is a digital sample preparation system for the decapsulation, thinning and polishing of packaged and wafer-level devices. Drawing on Ultra Tec’s knowledge and market leadership in the selected area preparation area, ASAP-1 IPS has been designed to be specifically ‘device centric’ – using a combination of advanced programming and tool patterns, force feedback and live machine- vision - to help the user obtain the best results with the highest yield.
The End-point module will be available for demonstration at the upcoming ISTFA 2012 Conference in Phoenix, Arizona.
properties of electronic device and packaging materials, in order to enhance the sample preparation process.
The ASAP-1 IPS is suited for use in compound semiconductor and silicon sample preparation.
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