Power Electronics ♦ news digest
employed in the semiconductor, TFT-LCD and electronics industry as well as the solar power isector. DAS also develops process and system solutions for treating industrial and communal waste water.
Riber receives MBE kit order from Chinese university
The MBE reactor will be used to grow new III-V compound semiconductor based structures
MBE system manufacturer, Riber, is announcing the sale of a Compact 21 MBE machine to SITP (Shanghai Institute of Technical Physics) a famous material research institute in China.
EVG150 system
The high-volume coater/developer has been completely redesigned to provide customers with a flexible, modular platform that integrates spin coating and developing with EVG’s advanced, proprietary spray coating technology.
SITP is a regular user of Riber MBE products specialised for the growth of thin film layers and quantum well structures.
This new Compact 21 system will enable the laboratory to increase its fundamental research capabilities on new III-V based structures.
With a more than 800 MBE machines installed base and its successful industrial experience, Riber is one of the leaders in the MBE-based compound semiconductor deposition market.
EVG releases novel automated resist platform
The fully automated modular system which can accomodate 50mm to 200mm wafers, integrates spray coating processes for compound semiconductor and advanced packaging
“Close collaboration with our customers made it clear that the next logical step for our coater/ developer technology was to create a universal approach for high-volume processing of devices with more complicated structures and topographies,” stated Markus Wimplinger, EV Group’s corporate technology development and IP director.
“This latest incarnation of our EVG150 system addresses customers’ production needs for back-end lithography, conformal coating and planarisation – all in one modular, fully automated platform. Leveraging EVG’s 15 years of experience in resist coating and developing, and particularly our spray coating, the EVG150 is ideally suited for high-volume coater/developer applications needing increased uniformity and process flexibility.”
Part of EVG’s resist processing equipment family, which addresses all wafer sizes up to 300 mm, the EVG150 platform can accommodate wafers from 50 mm to 200 mm in diameter, and enables up to four wet process modules to be combined with two stacks of hot plates, chill plates and vapour prime modules.
The system performs spin coating, developing, spray coating and lift off, and its modular structure
October 2012
www.compoundsemiconductor.net 125
Taiwanese firm, EV Group (EVG) has revealed its next-generation EVG150 automated resist processing system.
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