MODULEMANUFACTURING
Reis GmbH & Co. KG Maschinenfabrik www.reisrobotics.de
New concept Encapsulation
Fully automated assembly of the junction box:
The new system for fully automatic setting of the junction box is mounted on a platform completely ready for operation and thus, can be integrated in any existing production line with minimum expenditure. This new concept has many advantages compared to the conventional method. Due to this new concept, critical work steps before lamination are omitted: foil stamping unthreading of terminal lugs no emerging EVA during lamination no soiling of the membrane
This new method also avoids the risk of damaging the membrane during lamination due to protruding lugs. Here also an optimum of cost saving can be seen, since various manual and automatic work steps can be omitted and in addition also material savings are possible. Also the possible break rate is reduced, since no manual actions are required any more.
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Measuring system automatic tape application The new concept from Reis robotics requires little maintenance and few wear parts. Due to the newly designed application system the tape will be applied stress-free. This is realized by a synchronized drive.
This innovative concept allows a very precise cut of the tape length. Also, this concept completely avoids previous touching
of the adhesive surface to the glass. This innovative concept is an important improvement of the process capacity. Fully automated splicing can be integrated in order to ensure change from one tape coil to the other free from interruption.
New concept Encapsulation:
The new concept of encapsulation has been developed together with Dow Corning, the specialist in the range of silicones. Here, Reis Robotics is the "preferred supplier" for Europe, USA and Asia.
This system offers the following advantages compared to conventional lamination. low investment for the system considerably lower energy consumption faster cycle times, since no complete laminating cycle required an excellent stability to UV rays the modules will have a higher efficiency due to better transparency than with conventional encapsulation material a high electric stability
The new encapsulation system is suitable for silicon cell modules, thin-layer modules from glass/glass or glass/foil.
This new concept makes our customer save a lot in system investment due to a higher throughput at less space requirements of the system.
ROMMEL GmbH www.rommel.de.com
ModFlash HT Si
ModFlash HT Si, developed by ROMMEL GmbH and AESCUSOFT Automation GmbH, Germany, is a fully automated testing solution for flat pannel Si modules. Based on a completely new vision and measurement method, the system is able to realize attributes like sunny side down testing, auto contacting, inline capability and auto labeling in just one compact machine. Thereby, ModFlash HT Si can be set up as stand-alone system or in-line integrated into a fully automated solar line. ModFlash HT Si is the first compact solution on the market, able to make highly accurate measurements of ± 1.5 % for the performance of standard solar panels. A concentrator cell/ panel tester is also available. Solar technology manufacturers can securely prove the capacity of their panels.
ROMMEL GmbH, a member of the Mühlbauer group, specializes in turnkey solutions for the automation of production lines (Automation & Board Handling) as well as for the marking and
tracing of divers products (Marking & Traceability). A special area is the laser marking process for the traceability of security relevant parts in the electronics industry. In addition, the company is well-established as turnkey solution partner for production automation in the field of solar technology, especially in the concentrator technology (CPV).
Based on the integration of ROMMEL GmbH into the internationally active Mühlbauer Group with almost 2,000 employees, the company has benefited from a continuously extended global service and sales network with currently 30 locations since 1981.
Technology centers in Germany, the USA, Malaysia and Slovakia, competence centers for vision, laser and RFID technology as well as a strong parent company provide a sound basis and enable extensive synergies.
www.solar-pv-management.com Issue II 2010
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