Page 8

Test for gross and fine leaks in as little as 6 minutes.*

Continued from page 1

ing that creates consistent, high- quality output will power large- scale production on par with tra- ditional techniques like casting and injection molding.” For objects that will become

Only NorCom optical leak technology detects both gross and fine leaks in hermetically sealed packages, this fast. Instead of using multiple technologies

and processes, you can leak test virtually any type of package with one high-speed system. The NorCom 2020™

series inspects hermetically sealed components to

MIL-STD 883 requirements either in seam seal trays, or when already mounted tocircuits boards and assemblies. Itautomaticallyrejectsfailed devices, and reports the leak rate for each part, eliminating “divide and conquer”leak testing.

NorCom 2020™

Try it free. Send us your package samples today, for a leak test evaluation and report at no charge. *Note: Test time is dependent on package volume

610-592-0167 1055West Germantown Pike Norristown, PA 19403 USA

functional circuits, ESD-safe ma- terials can be used to create structure for metal traces and housings for components. These housings or carriers may be de- veloped whole or in separate parts then joined with adhesives, ultrasonic welding or fine elec- tron beam processing. Multiple objects can be built side-by-side on the same platform, saving time by making identical copies. 3D printing removes the

boundaries of building enclosed objects without access to their centers. Electronics can be safely embedded within structural housings, creating complete de- vices that require no further in- terior access by the designer. An early example comes from 2016, when Stratasys and NTU’s Sin- gapore Centre for 3D Printing, fabricated a functional drone with embedded electronics. Due to the broad range of

TechniFlex LCL 1000/423M U Series

New - Direct Imaging Fine Pitch Liquid Photo Imageable Flexible Black Soldermask

useful materials, sensors can be easily built on or into razor-thin flexible substrates. These can be sewn into garments, providing environmental data about the conditions surrounding the wearer. They can also be used to monitor the wearer’s health, such as heart rate, skin tempera- ture and moisture, and further down the line, even monitor elec- trical brain activity.

Conjunction Function There are several types of

conductive inks available. Nano Dimension, an Israeli firm and pioneer of 3D printed electronics materials and equipment, uses silver nanoparticles roughly 10 to 100 nm in size in its AgCite™ family of inks. These inks require low

TechniFlex LCL1000F/423M U Series offers cutting-edge advantages to today’s flexible circuits. Strong yet highly flexible with no cracking, extremely fine pitch details, able to withstand high temperature reflows and hot bar application.

• High Flexibility Matte Black Finish • Extremely Fine Pitch Resolution • High Soldering Temperature Resistant

Available in two versions:

U6 for direct imaging/manual exposure for standard cut sheet flexible circuit panel and roll to roll applications

U7 for direct imaging/manual exposure for high multiple layer cut sheet flexible circuit panels and roll to roll applications

March, 2021 3D Printed Electronics...

enough sintering temperatures to be used on extremely sensitive substrates, such as paper, poly- mers, glass, and indium tin oxide (ITO), which depending on its oxygen content can be described as either a ceramic or an alloy. One novel type of conductive

ink has been developed by a team of researchers from MIT and Harvard, which eliminates the need for sintering altogether. The ink contains conductive par- ticles, triblock copolymers and a volatile solvent. The material is deposited onto a substrate layer by layer. After extrusion, the sol- vent evaporates and the conduc- tive interconnects are left be- hind.

Fostering Adoption The most stubborn obstacles

to adoption of additive electron- ics manufacturing are the high cost of materials and equipment, the fairly slow pace of current 3D printing systems and quality of the final product — though, speaking broadly, these are the same issues with every new tech- nology.

However, 3D printing com-

panies are finding great success in research and development ap- plications. The ability to churn out iterations on the way to the final product without waiting for parts, PCBs and tooling to arrive accelerates innovation and in- vention. Most 3D printing equipment

today is fairly compact and easy to fit into a lab or small work- shop, and does not require much more than power and a steady supply of materials. Adoption may be slower than some futur- ists and Industry 4.0 enthusiasts have predicted, but the evidence seems to point toward an eventu- al transformation of traditional manufacturing into a more adaptable, customizable produc- tion process heavily dependent on 3D printing. r

A Sharper Look into Nano-sized Structures

Continued from page 6

lab, taking advantage of high harmonics. These harmonics are produced by the interaction of a laser with a medium and have frequencies many times that of the original. “We generate light with a

wavelength between 10 and 80 nanometers using infrared lasers,” explains Dr. Gerhard Paulus, Jena professor of nonlinear optics. XUV light is coherent, meaning it has laser-like properties. The physicists exposed

Learn more about Technic’s full line of TechniFlex products, visit us at

nanoscopic layer structures in silicon to the coherent XUV radi- ation and analyzed the reflected

light. The silicon samples con- tained thin layers of other met- als, such as titanium or silver, at different depths. Because these materials have different reflec- tive properties from the silicon, they can be detected in the re- flected radiation. The method is so precise

that not only can the deep struc- ture of the tiny samples be dis- played with nanometer accuracy, but, due to the differing reflec- tive behavior, the chemical com- position of the samples can also be determined precisely and non- destructively. Web: r

Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96