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Page 8


www.us-tech.com


Test for gross and fine leaks in as little as 6 minutes.*


Continued from page 1


ing that creates consistent, high- quality output will power large- scale production on par with tra- ditional techniques like casting and injection molding.” For objects that will become


Only NorCom optical leak technology detects both gross and fine leaks in hermetically sealed packages, this fast. Instead of using multiple technologies


and processes, you can leak test virtually any type of package with one high-speed system. The NorCom 2020™


series inspects hermetically sealed components to


MIL-STD 883 requirements either in seam seal trays, or when already mounted tocircuits boards and assemblies. Itautomaticallyrejectsfailed devices, and reports the leak rate for each part, eliminating “divide and conquer”leak testing.


NorCom 2020™


Try it free. Send us your package samples today, for a leak test evaluation and report at no charge. *Note: Test time is dependent on package volume


www.norcomsystemsinc.com


610-592-0167 1055West Germantown Pike Norristown, PA 19403 USA


functional circuits, ESD-safe ma- terials can be used to create structure for metal traces and housings for components. These housings or carriers may be de- veloped whole or in separate parts then joined with adhesives, ultrasonic welding or fine elec- tron beam processing. Multiple objects can be built side-by-side on the same platform, saving time by making identical copies. 3D printing removes the


boundaries of building enclosed objects without access to their centers. Electronics can be safely embedded within structural housings, creating complete de- vices that require no further in- terior access by the designer. An early example comes from 2016, when Stratasys and NTU’s Sin- gapore Centre for 3D Printing, fabricated a functional drone with embedded electronics. Due to the broad range of


TechniFlex LCL 1000/423M U Series


New - Direct Imaging Fine Pitch Liquid Photo Imageable Flexible Black Soldermask


useful materials, sensors can be easily built on or into razor-thin flexible substrates. These can be sewn into garments, providing environmental data about the conditions surrounding the wearer. They can also be used to monitor the wearer’s health, such as heart rate, skin tempera- ture and moisture, and further down the line, even monitor elec- trical brain activity.


Conjunction Function There are several types of


conductive inks available. Nano Dimension, an Israeli firm and pioneer of 3D printed electronics materials and equipment, uses silver nanoparticles roughly 10 to 100 nm in size in its AgCite™ family of inks. These inks require low


TechniFlex LCL1000F/423M U Series offers cutting-edge advantages to today’s flexible circuits. Strong yet highly flexible with no cracking, extremely fine pitch details, able to withstand high temperature reflows and hot bar application.


• High Flexibility Matte Black Finish • Extremely Fine Pitch Resolution • High Soldering Temperature Resistant


Available in two versions:


U6 for direct imaging/manual exposure for standard cut sheet flexible circuit panel and roll to roll applications


U7 for direct imaging/manual exposure for high multiple layer cut sheet flexible circuit panels and roll to roll applications


March, 2021 3D Printed Electronics...


enough sintering temperatures to be used on extremely sensitive substrates, such as paper, poly- mers, glass, and indium tin oxide (ITO), which depending on its oxygen content can be described as either a ceramic or an alloy. One novel type of conductive


ink has been developed by a team of researchers from MIT and Harvard, which eliminates the need for sintering altogether. The ink contains conductive par- ticles, triblock copolymers and a volatile solvent. The material is deposited onto a substrate layer by layer. After extrusion, the sol- vent evaporates and the conduc- tive interconnects are left be- hind.


Fostering Adoption The most stubborn obstacles


to adoption of additive electron- ics manufacturing are the high cost of materials and equipment, the fairly slow pace of current 3D printing systems and quality of the final product — though, speaking broadly, these are the same issues with every new tech- nology.


However, 3D printing com-


panies are finding great success in research and development ap- plications. The ability to churn out iterations on the way to the final product without waiting for parts, PCBs and tooling to arrive accelerates innovation and in- vention. Most 3D printing equipment


today is fairly compact and easy to fit into a lab or small work- shop, and does not require much more than power and a steady supply of materials. Adoption may be slower than some futur- ists and Industry 4.0 enthusiasts have predicted, but the evidence seems to point toward an eventu- al transformation of traditional manufacturing into a more adaptable, customizable produc- tion process heavily dependent on 3D printing. r


A Sharper Look into Nano-sized Structures


Continued from page 6


lab, taking advantage of high harmonics. These harmonics are produced by the interaction of a laser with a medium and have frequencies many times that of the original. “We generate light with a


wavelength between 10 and 80 nanometers using infrared lasers,” explains Dr. Gerhard Paulus, Jena professor of nonlinear optics. XUV light is coherent, meaning it has laser-like properties. The physicists exposed


Learn more about Technic’s full line of TechniFlex products, visit us at www.technic.com


nanoscopic layer structures in silicon to the coherent XUV radi- ation and analyzed the reflected


light. The silicon samples con- tained thin layers of other met- als, such as titanium or silver, at different depths. Because these materials have different reflec- tive properties from the silicon, they can be detected in the re- flected radiation. The method is so precise


that not only can the deep struc- ture of the tiny samples be dis- played with nanometer accuracy, but, due to the differing reflec- tive behavior, the chemical com- position of the samples can also be determined precisely and non- destructively. Web: www.uni-jena.de r


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