March, 2021
LAKEVILLE, MN — ITW EAE’s Camalot® Prodigy™ dispensing system has been designed to enable higher process speeds, more precise accuracies, tighter
www.us-tech.com A special board-staging op -
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ITW EAE Upgrades Camalot Prodigy Dispensing System Camalot has released Dyna -
mic Dual Head™ (DDH), which offers the unique ability to dou- ble dispense speed, while main- taining the highest level of accu- racy for both dispense pumps. The patented design corrects for part-to-part rotation in real time, allowing synchronous dispensing of both pumps. Camalot has also released
Camalot Prodigy dispensing system.
tolerances, and higher yields. A state-of-the-art x/y gantry
system is the heart of this next- generation dispenser. Linear drive technology, refined motion control architecture, and a rigid, innova- tive frame design provide excellent performance and reliability.
ZYMET Joins Study of Edgebond Efficacy
EAST HANOVER, NJ — ZYMET recently contributed to a study of microstructure degradation in board-level reliability testing. The results were presented in a paper, first at ECTC 2020, in which resid- ual stress and lattice strain were visualized using EBSD strain con- tour and grain reference orienta- tion deviation (GROD) maps. Comparative specimens were
generated while investigating the efficacy of reworkable edgebond adhesives for enhancing the ther- mal cycle performance of a large wafer-level package (WLP). The work was done and presented by Dr. Tai-kyu Lee, associate profes- sor of materials science at Port - land State University. Partici - pants included members of Cisco, Foxconn and ZYMET. The research shows that
using reworkable edgebond adhe- sives on WLCSPs can improve board-level reliability from 300 to 1,000 percent, depending on the adhesive’s configuration. In the study, thermal cycle testing from –40 to +257°F (–40 to +125°C) was performed on a 0.47 in. (12 mm) WLCSP assembled with SAC sol- der on a rigid PCB. Non-bonded assemblies were compared with those bonded by a reworkable edgebond adhesive, applied in both dot-edgebond and full-edge-
bond configurations. Contact: ZYMET, Inc., 7
Great Meadow Lane, East Han - over, NJ 07936 % 973-428-5245 E-mail:
info@zymet.com Web:
www.zymet.com
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identco.com
NuJet™, a jetting technology for the Prodigy dispenser that elimi- nates the use of a needle and incorporates a state-of-the-art pneumatic actuator that gener- ates an operating frequency of up to 300 Hz.
tion can double or even triple the dispense area in the x axis, allow- ing products larger than 35.4 in. (900 mm) to be processed. Contact and non-contact heating in several configurations, including heated lift chucks, ensures that dispensed materials are at a controlled, con- stant temperature and flow rate for underfill and encapsulation. The Prodigy’s features are
easily field upgraded, due to plug and play compatibility and sim- plicity. They can be retrofitted in the field, including heat, pumps, weight scale, second z axis, and even the conveyor system.
Independent dual head config- urability allows dispensing of different materials in a single process. Both z-axes are inde- pendently controlled, facilitating both high positional accuracy and fast axis movement. Synchronous dual head mode operates both pumps simultane- ously and reduces dispense time
by approximately 50 percent. Contact: ITW EAE, a divi-
sion of Illinois Tool Works, 8860 207th Street West, Lakeville, MN 55044 % 952-469-8278 E-mail:
roger.dullinger@itweae.com Web:
www.itweae.com
See at IPC APEX (virtual)
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