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March, 2021


www.us-tech.com


Optimizing Smart Factory Process Control with True 3D Inspection Data


Continued from previous page


processes that increase board quality and decrease production costs. Process control suites, such as KSMART


from Koh Young, can revolutionize data col- lection and analysis, and as a result, optimize PCB assembly.


Measurement-Based Inspection Not only is it difficult for 2D AOI sys-


tems to identify defects on curved and reflec- tive solder joints, both 2D and 2.5D AOI sys- tems do not generate reliable measurement- based data. Every aspect of the 2D or 2.5D process


relies on contrast, not quantitative measure- ment. Users of these systems must then scrap or rework defec- tive boards, increasing costs. Results from these systems are also limited in their application of AI to improve the overall manu- facturing environment. The introduction of 3D imag-


ing solved many of these issues. By measuring components and solder joints, then providing height information to the inspec- tion algorithms, manufacturers could locate errors like pad over- hang and insufficient solder. However, the validity of meas-


urement data was questionable, since most 2D and 2.5D AOI uses “blob detection” to find the body of a component and lead tips. This technique is susceptible to other external factors, such as board warpage and component proximity. Since finding the component


body and lead tip is the first step in the inspection process, it is critical that it is done correctly. If inaccurate, this measurement is detrimental to the entire inspec- tion sequence and contributes significantly to false calls. True 3D inspection systems


can overcome this challenge for all types of components by extracting their exact dimensions and loca- tion. Koh Young’s Zenith AOI series uses a parallel computing engine to process true 3D meas- urements. Using patented shadow-free


3D technology, the Zenith series measures every aspect of the com- ponent and solder joint in accor- dance with IPC-A-610. The quality of Koh Young’s


measurement data has given rise to its industry-leading measure- ment-based analysis and optimiza- tion solutions, including its KSMART process control software. Measurement data can then be fed to proprietary AI engines for con- tinuous process improvement. KSMART collects all inspec-


tion and measurement data from each piece of equipment with its central hub, then provides that data to any other part of the net- work. It is accessed through an intuitive web-based application. The beauty of this powerful analytical tool is traceability.


Introducing the all new XQuik II Plus:  solution for your com- ponent counting needs





The next generation of the popular XQuik series with improved speed, higher counting accuracy and lower cost provides greater labor savings  updates. Count both a single reel or up to 4 reels in under 20 seconds.


s s


ls s VJ Electronix 19 Alpha Rd. Chelmsford, MA 01824-4124


www.vjelectronix.com Email: electronixsales@vjt.com


Tel: +1 631 589 8800


KSMART ensures high levels of transparency by showing the condition of all lines, while pro- viding required documentation for changes to job files, packages, parts, and more. KSMART is the gateway to a smart factory.


Accurate 3D Data Manufacturers should not settle for any-


thing less than reliable, repeatable and relat- able measurement data in the PCB assembly process. Data is a crucial element for success and improvement, especially when leverag- ing AI solutions. Experts link the effectiveness of deep


learning to the quality and quantity of the data used to address many different require-


ments across many fields. Most advanced inspection system providers want to use AI to build smarter inspection systems. However, it has been difficult to realize, due to the lim- itations of 2D and 2.5D imaging. Not only is it difficult for these types of


systems to identify solder and dimension- related defects, but these systems rely on 2D features, such as contrast, binarization and reflections, making it extremely challenging to correlate to the quantitative measurement of 3D objects. If done correctly, true 3D inspection can


offer very valuable data — in effect becoming the most reliable “sensor” on the line.


Continued on page 53


Page 51


                     


Summit LXi The #1 Large Board Rework Solution. The Industry’s choice for 5G Applications


S T


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In 5


HiHigh precision, semi-automatic system capable of handling boards up to 25’’x47’’ and components as


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of a


as small as 01005.


Bohemia, NY • Suzhou, China • Hartzviller, France • Budapest, Hungary • Bengaluru, India 4:08 PM


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