March, 2021
www.us-tech.com
Page 59 Improving the Energy Efficiency of Soldering Systems Continued from previous page
energy consumption. The quick reaction time of the pulsar
heaters is another critical factor. When pro- cessing various products with different ther- mal demands, requiring individual parame- ter settings, as mentioned before, there is no need to wait between product groups for the machine to change. Configuring individual emitters instead of
entire segments enables much tighter process control, and no adjustment time is needed for the next different product up the line.
Greater Flexibility Flexibility in preheating can only be
achieved if there is already flexibility in sol- dering. Most wave soldering sys- tems are equipped with one or two nozzles that generate a tur- bulent wave. This is good enough for most products, but it cannot be used for more complex PCBs, such as those with masked areas. The trend in the industry is clear: component density on both sides of the PCB is increasing, and the number of SMT compo- nents on the side of the board with THT ends to solder is also continuing to increase. Switching to selective sol-
dering is not always an option. If the existing wave soldering machine is to be used, solder masks can be effective. Masks eliminate the extra process step of gluing SMT components before they are soldered alongside THT components. Masks are used to cover sen-
sitive parts to prevent them from being exposed to the solder wave. But, this is not a perfect solution, as then reliable wetting of all the components that need to be sol- dered is not guaranteed, depend- ing on the thickness of the mask and the size of the cutouts. Also, it can be challenging to
create a reproducible process if there is little distance between covered SMT components and THT pins. Masks used for complex and
sophisticated assemblies often show defects, such as incomplete solder joints or bridging.
Leveraging Automation Factors like automatic noz-
zle height adjustment that does not affect the overall cycle time offer an innovative approach to these applications. The height of each nozzle can be adjusted by the software to within 0.8 in. (20 mm) of the product. Automatic nozzle height
adjustment provides additional process reliability and better product quality, since all solder joints are wetted reliably and component-defined solder peel- off available. SEHO links automatic noz-
zle height adjustment to its sec- tor soldering feature. This func- tion allows users to create parameters for wave height and conveyor speed individually for
Until recently, it has not been possible to automatically measure and adjust solder height in wave soldering.
up to 16 circuit board sectors, providing a large process window and maximum flexibil- ity. This also ensures that the system can meet future challenges. Automated process control systems
increase the reliability and stability of the soldering process. This reduces the risk of defects, bringing down overall costs. The fun- damental parts of the soldering system are carefully monitored, such as preheat temper- ature, flux level, the solder pot, and product transport through the machine. The consistent height of the solder wave is
also crucial for wave soldering. An irregular wave height can result in poor hole fill or incomplete wetting. It is a significant advan-
Continued on page 61
Accepts Challenges, Delivers Results. The ultimate multi-process inspector for paramount speed, accuracy and ease of use.
AOI
SPI
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The SQ3000™ (MRS™
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making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.
www.cyberoptics.com Copyright © 2020. CyberOptics Corporation. All rights reserved. See at IPC APEX (virtual)
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