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www.us-tech.com
March, 2021
OSAGE BEACH, MO — Nihon Superior is exhibiting its newly developed TempSave series of low-temperature soldering materi- als, as well as its NozzleSave alloy, SN100CV P608 and LF-C2 P608 solder pastes. Nihon Superior’s TempSave™ series of
low-temperature soldering materials is designed to address the industry’s goals of reduced peak reflow temperature. This trend is being explored to reduce defects that con- tribute to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature-sen- sitive devices. TempSave B58 is a eutectic tin-bismuth
Nihon Superior Debuts Low-Temperature Soldering Materials
alloy with a melting point of 282°F (139°C), while TempSave B37 is a ductile hypo eutec- tic tin-bismuth alloy and does not contain gold. High bismuth containing alloys are known to be brittle and poor in drop shock performance as a result. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is
specifically designed for bismuth alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 374°F (190°C). TempSave B37 is available in solid wire form. Nihon Superior’s NozzleSave S solder
alloy is formulated to double the life of selec- tive soldering nozzles. As solder nozzles wear, the solder wave form from the nozzle and wave height are affected. This can save signif- icant costs and improve overall solder quality. SN100CV® P608 is a completely halo-
gen-free, lead-free, no-clean solder paste. Unlike silver containing alloys that derive their strength from a dispersion of fine parti-
cles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the
Testing of electronics in the era of miniaturization
25+ years in the heart of electronics
Customers in 50+ countries
10,000+ systems sold 2,500+ customers
Worldwide support
SN100CV alloy matches the strength of SAC305 while maintaining a high level of resistance to impact loading. LF- C2 is a high-reliability lead-free alloy as it uses both dispersion and solid solution strengthening. With a liquidus temperature of 415.4°F (213°C) it can be reflowed at a lower temperature than SAC305. The P608 flux medium pro-
vides wetting comparable with that of halogen-containing paste, though is itself completely halo- gen-free. SN100CV P608 and LF- C2 both deliver excellent per- formance over a wide range of component types and process
parameters. Contact: Nihon Superior
USA, LLC, 1395 Hawk Island
Drive, Osage Beach, MO 65065 % 573-280-2357 E-mail:
k.howell@
nihonsuperior.co.jp Web:
www.nihonsuperior.com
See at IPC APEX (virtual)
Magnalytix Website Adds Technical Library
NASHVILLE, TN — Magnalytix, a leading driver of providing real- time reliability solutions for elec- tronics manufacturing, has intro- duced its Magnalytix Tech nical Library, an enhanced knowledge base located on its web site under “Tech Corner.” The library is a collection of
technical papers, presentations and informational videos created by the co-founders as well as inventors of Magnalytix, Dr. Mike Bixenman and Mark McMeen. The library provides inside knowl- edge regarding SIR testing, identi- fying objective evidence, solving reliability issues, pro cess control options, and more, at no cost. The Tech Corner’s library is
updated frequently to provide cur- rent and trending information. It is also the first of many planned
Get the white paper
Want to know more about our solutions and products? Contact us at 410-770-4415, send an email to
info@jtag.com or visit our website at
www.jtag.com.
See at IPC APEX (virtual)
updates to the website to come. Contact: Magnalytix, 424
Harding Industrial Drive,
Nashville, TN 37211 % 856-524-1110 E-mail:
spollock@magnalytix.com Web:
www.magnalytix.com
See at IPC APEX (virtual)
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