May/June, 2012
www.us-tech.com
ACE Introduces Manual Lead Tinning Station
Spokane Valley, WA — ACE Production Technologies has intro- duced its Manual Lead Tinning System, or MLTS, an ergonomic, affordable system for re-tinning the
usually requiring complicated robot- ics and often resulting in bridging and rework. Sending these very deli- cate components to a tinning house (sometimes across the country) is very expensive and time consuming. The MLTS employs a unique
tinning method using a specially designed “side wave” solder nozzle that is heavily purged with nitrogen. The side wave process uses the natu- ral cascade of the solder to scrub the old plating off while wicking away
excess solder during the extraction of the form’s leads, leaving the leaded array bridge-free. This process is so robust that even tinning FPQFPs by hand holding the components with a vacuum wand works very well. This latter discovery led to the creation of the MLTS. The MLTS is an ergonomically
designed work station for one person to easily handle all forms of compo- nent lead tinning. The MLTS can be configured with one or two solder
pots with either the “side wave” or straight “immersion” nozzles, and flowing flux station. The solder pots and fluxers are operated through foot switches minimizing the solder pumping and keeping N2
tion to a minimum. Contact: ACE Production
Technologies, 3010 N. Industrial Park, First Street, Spokane Valley, WA 99216 % 509-924-4898 E-mail:
sales@ace-protech.com Web:
www.ace-protech.com
consump-
Page 25
Tinning “by hand” using a vacuum pick.
delicate leads of fine-pitch Quad Flat Pack SMDs (QFPs) reliably in-house, without bridging. It’s especially use- ful for meeting the needs of hi-rel, Military, and Avionics component refurbishing. In describing the new machine,
the company said that the MLTS is unique — it’s an affordable way to tin the leads of fine-pitch QFPs without bridging. The machine eliminates the need to send them out to be done somewhere else at high cost, with attendant shipping delays and lead times. Now they can be done “right at home” under house control quickly and reliably and for a fraction of the cost of outsourcing to someone else. The MLTS is excellent for both smaller assembly houses as well as larger contract houses with dedicat- ed assembly work cells. Removing gold plating, replac-
ing RoHS finish with Pb, refurbish- ing legacy components and tin whisker mitigation are the major reasons to hot solder dip component leads. This applies to both through- hole and Surface mount components. Tinning fine pitch QFPs (FPQFPs) is especially difficult to do in house
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