May/June, 2012
www.us-tech.com
Page 23 Nihon Superior Intros Alloy in Spheres
Osaka, Japan — Nihon Superior Co. Ltd. has introduced the first of the company’s new SN100C Advantage Series™ alloys, SN99CN in the form of spheres and the solder paste SN99CN P502 D4. While based on the proven SN100C Sn-Cu-Ni tech- nology, which now has a track record of more than 13 years of successful delivery of high productivity and reli- ability, SN99C has a controlled addi- tion of Ag for enhanced strength and intermetallic stability. In high-speed pull testing of
joints reflowed to a copper sub- strate, its ranking in comparison with other common alloys in terms
of fracture energy at pull speeds ³10mm/s is: SN99CN>SN100CrSn- 37Pb>Sn-3.0Ag-0.5Cu. SN100C is a compliant alloy that provides high impact strength and substantial cost advantages. For situations where voiding
must be minimized, the company has introduced SN100C P810 D4, which has been formulated specifically to facilitate optimum performance of nitrogen atmosphere vacuum reflow systems. While by itself the vacuum reflow process can be effective in achieving a much lower incidence of voiding than conventional reflow processes, its use with the SN100C P810 can further reduce the residual
Isola and Circuit Foil Launch Ultrathin Laminate
Chandler, AZ — Isola Group S.a.r.l. and Circuit Foil Luxemburg S.a.r.l., a manufacturer of high-quality elec- trodeposited (ED) copper foils, have jointly released an ultrathin 40µ laminate. The two companies have jointly developed the product, which will initially be available in high glass-transition temperature (Tg), phenolic-cured resins. The product has a glass-transition temperature in excess of 170°C. The product is a major improve-
ment over existing technologies, as the laminate is glass reinforced and therefore does not have thermo- mechanical mismatch issues com- monly associated with unreinforced films.
The mechanical properties,
such as the Young’s modulus (Tensile Modulus), and thermal expansion coefficient are similar to high-Tg systems, as opposed to a low value of the modulus and high values of thermal expansions typical with ultrathin film. The low modulus and high ther-
mal expansion coefficients of unrein- forced products cause interlaminar stresses during the high temperature assembly process, leading to delami-
nation issues. Contact: Isola Group S.a.r.l., 3100 West Ray Rd., Suite 301,
Chandler, AZ 85226 % 480-893-6527 or 480-893-1409 Web:
www.isola-group.com
See us at AATE Booth 1260 and SMT Hybrid Pkg. Booth 9-140 Lead-free solder paste.
voiding to less than 1 percent of the joint area. This is particularly impor- tant in large area joints to compo- nents such as QFN where heat trans- fer has to be maximized. Wetting performance is not compromised and this paste typically can be reflowed with a profile similar to that com- monly used with SAC305 and SAC405 solder pastes with a peak
around 240°C. Contact: Nihon Superior Co.
Ltd., NS Bldg., 1-16-15 Esaka-Cho,
Suita City, Osaka, 564-0063 Japan % 81-(0)6-6380-1121 fax: 81-(0)6-6380-1262 Web:
www.nihonsuperior.co.jp
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