June, 2018
www.us-tech.com
Rehm Highlights Soldering Versatility and Transparency
Roswell, GA — Rehm is now offering its latest innovations in soldering, which include systems to make the soldering process more versatile and completely transparent.
The need to provide correspon- ding data for digitized processes is a must today. The ViCON Connect soft- ware tool controls and monitors all Rehm systems within a company net- work, and the ViCON mobile app pro- vides instant access to all relevant sys- tem information.
The company has also further developed its guided maintenance sys- tem, which makes use of the Microsoft HoloLens, and is now offering the first demo version of its ViCI Virtual Communication Interface for ViCON. Rehm’s VisionXP+ is the com- pany’s flagship product for reflow convection soldering with or without vacuum. The latest generation uses EC fan motors, which are quieter and
BTU Presents PYRAMAX and Profile Guardian
North Billerica, MA — BTU Inter- national is exhibiting its line of advanced thermal processing equip- ment for electronics manufacturing alongside its distributor EPP Elec- tronic Production Partners GmbH at SMT Hybrid Packaging. The company is highlighting its Profile Guardian redundant process monitor and PYRAMAX™ 100A reflow oven. Profile Guardian pairs a thermo- couple probe at product height with software to monitor temperature devi- ation from baseline — independent from control TCs. The redundant process monitor is aware of oven state (recipe change, energy savings modes, etc.), and monitor data can be includ- ed in host communications (MES) from the oven. It provides board level traceability when paired with barcode readers, which is a requirement for many large OEM/EMS customers. The PYRAMAX 100A contains 8.2 ft (2.5m) of heated length and eight zones, a maximum temperature of 662°F (350°C), flexible platform config- uration, low power consumption, and a comprehensive selection of options. The PYRAMAX includes BTU’s propri- etary WINCON™ control system. WINCON has a simple user interface and powerful analytical capabilities. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assem- blies and in semiconductor packag- ing processes. BTU also specializes in precision controlled, high-temper- ature belt furnaces for a wide range of custom applications, such as braz- ing, direct bond copper (DBC), diffu- sion, sintering, and advanced solar cell processing. Contact: BTU International, Inc., 23 Esquire Road, North Billerica, MA 01862 978-667-4111 fax: 978-667-9068 Web:
www.btu.com
See at SMT Hybrid Packaging, Booth 4-551
more sustainable than those used in the past, and also enable comprehen- sive operation data collection. The VisionXC soldering system is designed to provide high quality assembly in low-throughput manu- facturing. The compactness of the system brings together all of the com- pany’s key technology in a small form factor. The VisionX series also includes ViCON software and an updated user interface.
The CondensoXC is a condensa- tion soldering system that uses Galden® as a heat transfer medium. A
patented injection system supplies the correct amount of liquid for optimal profiling. Its closed-loop filter system allows the medium to be recovered with nearly 100 percent efficiency.
Other products on display include the Nexus vacuum soldering system, Securo Minus range of sys- tems for cold function tests of elec- tronic components, and the Protecto conformal coating system. Contact: Rehm Thermal Systems, LLC, 3080 Northfield Place, Suite 109, Roswell, GA 30076 770-442-8913 fax: 770-442-8914 E-mail:
p.handler@rehm-group.com Web:
www.rehm-group.com
Rehm’s SMT product portolio.
See at SMT Hybrid Packaging, Booth 4A-100
A company of the Comet Group
Page 89
Why compromise?
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Cheetah EVOPLUS Cougar EVOSMT Cheetah EVOSEMI Cougar EVOPLUS Cheetah EVO SMT Cougar EVOSEMI GERMANY – HEADQUARTERS
YXLON International GmbH Essener Bogen 15
22419 Hamburg, Germany T: +49 40 527 29-0
www.yxlon.com
USA
YXLON COMET Technologies USA Inc. 5675 Hudson Industrial Parkway Hudson, OH 44236, USA T: +1 234 284 7849
www.yxlon.com
Comet Group Lab One 3055 Orchard Dr, Suite 150 San Jose, CA 95134, USA T: +1 408 325 8770
www.comet-group.com/lab-one
See at SMT/Hybrid Pkg, Booth 4A-350
Visit us at
Hybrid Packaging June 5 -7,2018
SMT
Nuremberg/Germany Hall 4A · Booth 350
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