June, 2018
www.us-tech.com
SMT Hybrid Packaging Takes on Additive Manufacturing
Nuremberg, Germany — SMT Hybrid Packaging 2018, to be held June 5 to 7, in Nuremberg, is a staple European event where guests and exhibitors mingle and share industry expertise. This year, one major topic is the rise of additive manufacturing, also known as 3D printing. Visitors value the system inte-
gration in microelectronics exhibition as it offers an opportunity to grow their business knowledge and expand personal networks. Visitors benefit from a mix of practical application and theory. The conference and tutorial program also provides a range of infor- mation on relevant industry topics. The exhibition will also host the IPC hand soldering competition. This competition will be held in
hall four and participants can win a prize, but may also have the chance to compete in the IPC hand soldering competition world championship in the U.S.A. This year, SMT Hybrid
Hubs Continued from previous page
ADM NewYork Education
Nuremberg, 5 – 7 June 2018
trends, but it will also bring more action to an already lively expo floor,” says Nina Brown, VP of events, UBM. Developed for medical device
engineers working in R&D, design and product development, the medtech education hub offers discus- sion of the latest innovations and breakthroughs affecting the medical device industry today. A panel discus- sion entitled “How Artificial Intel - ligence (AI) is Moving the Needle in Medtech” will cover AI and medical challenges, and its potential to change the industry. “Top Trends to Watch in Med -
tech: Innovation and Consolida tion” will highlight med tech’s current crossroads of health care and technol- ogy. How health care is delivered through medical devices and changes in technology will be discussed. The smart manufacturing edu-
cation hub will drill down on key innovations that are transforming manufacturing. Presentations will cover such topics as big data, robot- ics, AI, the Internet of Things (IoT), machine learning, smart sensors, and digital twins. One highlight will be “Learning
from Nature: the Mechanics Behind the Robotic Zoo.” Leading automa- tion companies have been creating a menagerie of bionic animals and insects. This presentation will dem - on strate how these robotic creatures affect current trends in R&D, test new technologies and manufacturing methods, and encourage creativity in product development. A presentation entitled “Mobil -
ity: the Driving Force Behind the Growth in Collaborative Robots” will explore the growth in demand for col- laborative robots, also called “cobots.” Contact: UBM, 2901 28th
Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.advancedmanufactur-
ingnewyork.com r
Save your free ticket now:
smthybridpackaging.com
Packaging is introducing the hand soldering competition for beginners. This competition follows the same guidelines as the professional event, but will use a PCBA that meets a beginner’s skill level. The combination of conference
and exhibition along the entire value chain of electronics production and assembly is a special opportunity for Europe. Developers, manufacturers, quality managers, and engineers have much to gain from this year’s program of events. On June 6, well-known speak- ers from companies that include
Heraeus Additive Manufacturing GmbH, LPKF Laser & Electronics AG, Murata Elektronik GmbH, and DB Engineering & Consulting will take part in a presentation that showcases 3D printing technologies and flexible forming in electronics production. Topics cover technologi- cal basics, as well as material requirements and conditions of machine use. June 7 will highlight the topic of
module reliability. Methods of high- quality analytics and today’s testing procedures and products will be dis- cussed in detail. Speakers from Rood -
Microtec GmbH, Viscom AG, HELLA GmbH & Co. KGaA and Siemens Healthcare GmbH will cover this topic in the automotive and medical areas, as well as the production of advanced system packages. SMT Hybrid Packaging will
also offer a range of application- focused workshops in both English and German. Contact: Mesago Messe
Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178 Stuttgart, Germany % +49-711-61946-0 fax: +49-711- 61946-91 E-mail:
smt@mesago.com Web:
www.smthybridpackaging.com
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