Page 16


ManageMent www.us-tech.com


Lab One Strengthens Relationships through In-Person Technology Demo


By Jacob Fattal, Publisher O


ffering a mix of technology that includes X-ray, electron beam and plasma control sys-


facility, demonstrates its technology with the help of the experts who de- veloped it and allows visitors to net- work with each other. Sometimes, however, it can be


tems, it can be difficult for Comet Group’s Lab One to show all its vari- ous capabilities at a conference or an exhibition. With a prime location in the center of Silicon Valley, Lab One attracts guests to a fully functional


beneficial to draw a larger crowd and offer something a little extra. At an event held in April, Lab One hosted approximately 100 people and treat- ed guests to a barbecue lunch. Ex- perts from the company mingled with customers and colleagues were able to meet in person and discuss business challenges and technology in a comfortable setting. Comet Group includes three key


divisions: YXLON, Plasma Control Technologies (PCT) and ebeam. YXLON offers X-ray and computed tomography (CT) systems for quality


assurance testing. These X-ray and CT systems are often used in the aerospace, automotive, electronics, and semiconductor industries, as well as for research and development (R&D) and medical devices. Non-de- structive testing can be especially useful for complex and expensive products, or during prototyping. PCT uses vacuum capacitors in


custom RF impedance-matching units for chemical vapor deposition


well as to eliminate the use of some toxic chemicals in industrial applica- tions.


Since so much of business these days is conducted through the inter-


June, 2018


net, in-person events are a refreshing way to strengthen relationships and bounce ideas around. Comet Group’s


and semiconductor etching. Having a working lab in San Jose allows Lab One to host engineers from many OEMs in the area and from abroad, enabling these companies to directly translate ideas and methods from the lab to their own chip-making processes easily. The electron beam technology of


ebeam is used for sterilization, mate- rial curing and thin-film develop- ment in semiconductor manufactur- ing, industrial use and medical de- vices. This technology can be used to create entirely new materials, as


Minimizes solder beading


High ECM performance under low standoff components


Excellent wetting


High print transfer efficiency with low variation


Very low bridging, slump, and solder balling


Typical Voiding >40% Void Area


Indium10.1HF <10% Void Area


Plasma to improve reliability – no bad connections!


Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/avoidthevoid/USTA


©2018 Indium Corporation


Contact us now to learn more. +1-800-326-1151 +1-925-827-1240 info@nordsonmarch.com


nordsonmarch.com VIA™ Series Plasma System


Indium10.1HF SOLDER PASTE


Halogen-Free, No-Clean, Pb-Free


How important are your connections?


> Desmear > Etchback > Panel


Cleaning


Lab One is setting the bar as an open and accessible forum for companies in Silicon Valley to mix and share


knowledge. Contact: Comet Group Lab


One, 3055 Orchard Drive, San Jose, CA 95134 % 408-325-8770 E-mail: paul.smith@cometusa.com Web: www.comet-group.com r


See at SMT/Hybrid Pkg, Booth 4-301


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104