June, 2018
www.us-tech.com
The Return of Vapor Phase Reflow Soldering
Continued from previous page
that no oxygen or other gases inter- fere. This eliminates the need for sol- dering in nitrogen. The heat transfer is done by a liquid, which is much more direct and more effective than radiation or air heating. Overheating is not an issue, since the temperature of the vapor is not higher than the boiling temperature of the liquid. This process is roughly ten
times faster than hot air and about eight times faster than IR heating. There is no need for excessive heat in the process. Typical lead-free vapor phase reflow operates at a tempera- ture of about 455°F (235°C). Vapor phase soldering also
transfers heat very efficiently. Natu- ral convection with water has a heat transfer rate anywhere between 100 and 1,000 W/m2K, while gas is be- tween 3 and 30 W/m2K. IR reflow sol- dering transfers heat at between 50 and 100 W/m2K, reflow soldering with convection in air sits between 40 and 120 W/m2K, and nitrogen is slightly less efficient at 30 to 110 W/m2K. Vapor phase reflow soldering has a heat transfer coefficient of 500
to 700 W/m2K. There are many advantages to
using vapor phase soldering. The envi- ronmentally friendly process can pro- vide reproducible soldering process conditions, no overheating of the PCB and its components, uniform heating of the PCB, and no risk of oxidization. It eliminates the need for pro-
tective gases and generates a thin liquid film that can penetrate the smallest openings underneath com- ponents, such as BGAs and FPGAs. It can also do away with labor-inten- sive procedures to determine desired temperature profiles. Vapor phase soldering, in its
new form, is becoming a practical al- ternative to IR processes. Much more efficient than using convection, the process has been made safe for human workers and the environment and offers many advantages over conventional soldering methods. Contact: IMDES Creative Solu-
tions, Schulstrasse 21, D-48455 Bad Bentheim, Germany % +49-0-5924-997337 E-mail:
m.van.stralen@
imdes.de Web:
www.imdes.de r
Creform Carts Move Parts Through to Final Assembly
Greer, SC — Creform Corporation’s engineers have designed and built a work-in-process (WIP) cart for an el- evator manufacturer that holds small batches of both large and small sheet metal parts before they go through various stages of manufac- turing on their way to final assembly. This cart has 12 compartments that assist in damage-free handling
ious cart levels can be easily reposi- tioned and reconfigured, depending on the application, with only simple tools.
The cart has four 4 in. (10.2 cm)
diameter swivel casters with ure- thane wheels for easy, stable and safe movement. Two of the casters have brakes that can be engaged when secured positioning is needed. The size and strength of the wheels lend themselves to easy movement of the cart from point to point in the manufac- turing process. With a handle at both ends, the cart is easy for an associate to reposition within the work area for con- venient loading and unloading. This particular cart meas-
ures 2.9 x 1.8 x 4.7 ft (0.9 x 0.5 x 1.4m) and is designed to hold up to 400 lb (181.4 kg). Higher- capacity and custom cart sizes can be ordered, as well as a va- riety of colors for visual identi- fication by department, prod- uct line, shift, and associate. The carts can also be config- ured for ESD applications. Options include feet,
WIP cart for sheet metal parts.
with easy loading and unloading. Three of the compartments are espe- cially tall to hold the largest compo- nents, while the other nine are short- er to hold a variety of part sizes. Each compartment has a robust
plastic floor and sturdy panels for part separation and to ensure mini- mal movement of the parts. The var-
rather than wheels, label hold- ers to identify positions, hooks, clipboards, and the cart can be outfitted with a hitch for towing by Creform AGV tugger units as
part of an AGV-supported kitting sys- tem. Creform carts are available as an assembled structure or kit with pre- cut pipes for quick, onsite assembly. Contact: Creform Corp., P.O.
Box 830, Greer, SC 29652 % 800-839-8823 fax: 864-877-3863 E-mail:
scsales@creform.com Web:
www.creform.com
P PROBLEM FAILED SOLDER JOINT
Page 43
• Ideal for automotive under-hood applications with elevated operating temperatures
SOLVED Solder Paste
askus@indium.com ©2018 Indium Corporation
Indalloy 276 • Low-voiding ®
• Better thermal cycling performance than SAC305 (-40/125, & -40/150 thermal cycling profiles)
• Meets HKMC MS184-01 testing criteria
• Easily substituted into existing Pb-free processes
Learn more:
www.indium.com/USTA Contact our engineers today:
See at SMT/Hybrid Pkg, Booth 4-301
REFLOW SOLDERING SYSTEMS
See us at
SEMICON West Booth 6168
FALCON ULTRA PROFILE 1200 Small Footprint • Efficient Power Use
Consistent High Yields • Precise Temperature Gradient
SIKAMA INTERNATIONAL, INC.
www.sikama.com
See at SMT/Hybrid Pkg, Booth 4-427
V RYER made in America siince
VE nce 1934.
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