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www.us-tech.com
Fujipoly Develops Low-Cost Connector for LCDs
Carteret, NJ —When placed between a printed cir- cuit board and an LCD display, the Carbon Zebra® Connector from Fujipoly® makes reliable electrical contact using 140 conductive pads per inch. The connector offers a current carrying ca-
pacity of 50 mA per 0.04 x 0.04 in. (1 x 1 mm) pad and can be specified in custom lengths up to 9 in. (23 cm). The low-cost interconnect device is made from
alternating layers of conductive carbon-filled and nonconductive silicone. This construction makes the connector suitable for devices with pad spac- ings as close as 0.02 in. (0.5 mm). To accommodate as many applications as possible, the connector is available in any width
from 0.015 to 0.12 in. (0.38 to 3 mm) and has an operational temperature range of –40 to +212°F (–40 to +100°C). Fujipoly America Corporation is a wholly
owned subsidiary of Fuji Polymer Industries Co., Ltd., of Japan. An ISO9001:2008-registered com- pany, Fujipoly America Corporation specializes in the fabrication of silicone rubber technology. The company offers Zebra elastomeric connectors, Sar- con® thermal interface materials (TIMs), fusible
tapes, and custom silicone rubber extrusions. Contact: Fujipoly America Corp., 900 Milik
Carbon Zebra connector for LCD displays.
Street, Carteret, NJ 07008 % 732-969-0100 fax: 732-969-3311 E-mail:
info@fujipoly.com Web:
www.fujipoly.com
Technic Launches Electrolytic Copper Plating Process
Cranston, RI — Technic has commer- cially launched its Elevate® Cu 6370, a versatile electrolytic copper plating process for advanced semiconductor packaging applications. Over the past two years, Elevate
Cu 6370 has been in limited release and used in wide variety of applica- tions. With slight modifications to the
June, 2018
Elevate Cu 6370 electrolytic copper plating process.
electrolyte, the process has been high- ly successful in tight redistribution layer (RDL) patterns, standard pil- lars, 8 mil (200 µm) tall mega pillars, bump on passivation structures, and other advanced packaging structures. The process is suited for a variety of semiconductor advanced packaging platforms, including FOWLP (fan-out wafer-level packaging) fan-in wafer- level packaging and 2.5/3D. Elevate Cu 6370 can be adjusted
to plate at lower speeds of 0.04 to 0.08 mil (1 to 2 µm) per minute or high speeds of 0.2 to 0.3 mil (6 to 7 µm) per minute. It can also be tuned to provide
a domed, flat or dished deposit. Contact: Technic, Inc., 47 Molter
Street, Cranston, RI 02910 % 401- 781-6100 E-mail:
info@technic.com Web:
www.technic.com
See at SMT/Hybrid Pkg, Booth 5-434
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