June, 2018
www.us-tech.com
Page 57
Integrating Functional Electronics into 3D Injection-Molded Plastics
By Jürg Schüpbach, Director of Sales and Marketing, Essemtec AG
electronic assemblies with mechanical buttons and switches. IMSE replaces these devices with single- piece solutions that are thin, light and strong, without compromising functionality. IMSE integrates a mixture of well-known pro-
A
duction technologies. These include flexible circuit printing, surface mounting components, thermo- forming, in-mold labeling, and injection molding. Parts made with IMSE can reduce the weight
of components that they replace by more than 70 percent. Wall thick- ness can be as slim as 0.08 in. (2 mm). IMSE has huge potential for growth in industries that include automotive, appliances, the Internet of Things (IoT), and industrial equipment. Tactotek has partnered with
Essemtec for pick-and-place and dis- pensing equipment. In addition to using Essemtec’s machines for its own production, TactoTek is recom- mending Essemtec to its licensed manufacturers that produce IMSE solutions around the globe.
IMSE Process The process starts with in-mold
labeling (IML) material, or another suitable material, such as natural wood veneer. Decoration is then printed. This is followed by printing electronics, including conductive cir- cuitry, touch controls and antennas. Electronic components, such as LEDs for illumination, are mounted using standard, high-speed pick-and- place machinery. Electronics are fixed to the mounting surface using specialized adhesives that are able to withstand the temperatures and pressures of injection molding. Once the electronics are in
place, the carrier is used as an insert for injection molding. Typical mold- ing materials include high-pressure, high-temperature plastics, such as polycarbonate (PC), acrylic (PMMA), acrylonitrile butadiene styrene (ABS), and for flexible designs, ther- moplastic polyurethane (TPU). A variety of building blocks can
be molded within IMSE parts, including printed flexible circuitry and wire harnesses, multicolored
IMSE technology replaces complex, mechanically controlled assemblies with single-piece, 3D-printed materials that contain integrated electronics.
lighting indicators, printed capaci- tive touch controls, sensors of all kinds, and antennas for wireless con- nectivity.
New Design Possibilities TactoTek IMSE is enabling a
range of new design possibilities, such as odd-shaped parts, innovative features and simplified construction. IMSE solutions are thin and can con- form to complex shapes, allowing designers to add electronics to loca- tions in devices that would not be possible with conventional electron- ics. Also, in IMSE devices, the elec- tronics are encapsulated and protect-
Touch-controlled wood veneer panels with integrated electronics.
new technology from Tacto Tek™, in-mold structural electronics (IMSE™) production, is ridding developers of complex, multi-part
ed in the plastic, making them extremely durable and immune to damage from vibration, moisture
and debris. Many products can benefit from injection-
molded structural electronics, including vehicles, home appliances, wearables, and health care devices. Tactotek has customized thin, formed user interfaces, such as vehicle control panels with lux- ury wood veneer surfaces, and home appliances with mode-specific lighting. The company encapsu- lates sensors, such as accelerometers, impact and ambient light sensors, directly into the surface skins of designs. The technology is used to provide
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See at SMT/Hybrid Pkg, Booth 5-220
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