June, 2018
www.us-tech.com
Seica Demonstrates “Next>” Series Production Systems
Haverhill, MA — Seica is demonstrat- ing its “Next>” generation of solutions at SMT Hybrid Packaging, represent- ing another leap forward for the com- pany’s range of production systems that includes flying probe test, solder- ing and inspection systems.
Joining the Next> series is the Viva 6 Next>, Seica’s latest evolution of its core management software platform. The software now comes in a 64-bit version complete with a new
reading, laser sensors, capacitive probes, pyrometers, optical fiber sen- sors for LEDs, mini-fixtures for boundary scan and onboard program- ming, and high-frequency probes able to measure signals at frequencies over 1.5 GHz.
The Firefly Next> laser selec- tive soldering system includes a state-of-the-art, high-efficiency laser source, a new spot angle on the board to be soldered, a fully-programmable donut spot and integration on a sin- gle axis of the laser. It also includes a
vision system and temperature sen- sor, which enables simple calibration and provides continuous, closed-loop feedback from the soldering process. The Dragonfly Next> is an AOI system that provides optical inspection capabilities of conformal coating as well as through-hole components on electronic boards. The compact slim bed-of-nails tester is the latest addition to the Next> series. The small, modu- lar tester is especially suitable for deployment in a series of systems, loaded either manually or by a robotic
solution. The Compact Slim has a 7.1 x 11.8 in. (18 x 30 cm) test area with an automated receiver designed for robot- ic loading. There are 14 slots available for the ATE instrumentation, up to six user power supply units and an inte- grated control and management unit. Contact: Seica, Inc., 110 Avco Road, Haverhill, MA 01835 603-890-6002-76-78 E-mail:
sigillo@seica.com Web:
www.seica-na.com
See at SMT Hybrid Packaging, Booth 5-220
Page 83
Pilot V8 Next> series flying probe system with Viva 6 Next> software.
graphical interface and a guided environment for creating test pro- grams according to each specific requirement.
The new platform continues to leverage its open architecture, fur- ther extending the the capability of integration with third-party soft- ware, such as TestStand™, giving programmers the freedom to combine test sequences using various plat- forms in the same program. The company is also offering its Pilot V8 Next> flying prober, the Firefly Next> laser selective solder- ing system, the Dragonfly Next> sys- tem for optical inspection and, for the first time, the new Compact Slim bed-of-nails tester. With a width of 11.8 in. (30 cm), the tester is an excellent solution for use with collab- orative robots in an automated line. All of the systems come with Seica’s industrial monitoring solu- tion onboard, which provides remote monitoring of current and voltage consumption, mains supply, temper- ature, light indicators and other parameters. This information can be used for preventive maintenance and to make the machines compatible with Industry 4.0.
The Pilot V8 Next> flying prober provides up to 20 mobile resources for testing an electronic board, including test probes which can each apply up to 2A current, high-resolution cameras for AOI, barcode and data matrix
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See at ADM NY, Booth 1646 and at SMT/Hybrid Pkg, Booth 4-101
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