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www.us-tech.com Indium Offers Reinforced Solder Preforms
Clinton, NY — Indium Corporation is now offering its InFORMS® solder preforms, which are composite pre- forms consisting of solder with a
reinforced matrix. This combination is designed to increase lateral strength and improve bondline copla- narity, providing excellent thermal
cycling reliability.
Indium’s InFORMS were de- signed to address some specific chal- lenges in the power electronics industry. The preforms provide engineers with an enhanced material for the development of reli- able and high-perform- ance modules. Due to the planarity improvements and standoff tolerances, the package design be- comes more predictable. Stronger and more de- pendable joints allow for high power densities. Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include: solders and fluxes; brazes; thermal interface
materials (TIMs); sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®.
June, 2018
InFORM solder preform reinforced by internal matrix.
Contact: Indium Corp., 34 Robinson Road, Clinton, NY 13323 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
See at SMT Hybrid Packaging, Booth 4-301
Pickering: Switching and Simulation Modules
Grants Pass, OR — Pickering Inter- faces is offering a broad range of mod- ular signal switching, simulation and cabling products for electronic test and verification. The company’s two- and four-slot USB/LXI modular chassis offer small and light- weight form factors, well-suited to portable, benchtop and space- restricted applications.
DL Technology has been the leader in micro dispensing technology for over 15 years. For more
www.dltechnology.com 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 •
sales@dltechnology.com
The modules are designed for desk or rack mounting and can be controlled remotely by USB or LXI Ethernet. Remote control over a network enables the switching function of a test system to be located as close as possible to the target equip- ment.
The new four-slot chassis supports up to four Pickering 3U PXI modules. Possible sys- tems include switching matrices up to 2208 cross points or up to 72 chan- nels of programmable resister/sensor simulation.
Both the two- and four-slot chassis are USB 3.0 compatible and
Switching and simulation modules for test and verification.
and tablets that support HTML5. Pickering’s BRIC™ ultra-high- density PXI matrix modules are robust 1A/20W switching modules with up to 4,096 cross points. They include the company’s new 0.16 x 0.16 in. (4 x 4 mm) reed relay, mak- ing the series a new generation of 1A PXI matrices with twice the density of other large matrix modules. The matrices are available in two, four or eight-slot PXI sizes and are designed for high-performance matrix requirements. With their high level of switching density, these PXI matrices allow a complete, func- tional ATE system to be housed in a single 3U PXI chassis.
Pickering’s millivolt thermocou- ple PXI simulator module is a low-volt- age source module suitable for simulat- ing the operation of a thermocouple. The module supports up to 32 channels from a single slot 3U PXI module, each with its own independent output of –100 to +100 mV and a remote sense that allows for the correction of ground voltages on each channel. Contact: Pickering Interfaces, Inc., 2900 Northwest Vine Street, Suite D, Grants Pass, OR 97526 541-471-0700 fax: 541-471-8828 E-mail:
ussales@pickeringtest.com Web:
www.pickeringtest.com
See at SMT Hybrid Packaging, Booth 4A-141
have a fully compliant LXI interface. These communications standards enable the chassis to be controlled directly through personal computers
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