June, 2018
Rolling Meadows, IL — Panasonic is presenting a new range of full manufacturing optimization products, heavily focused on cyber-physical sys- tems, at SMT Hybrid Packaging. The company’s integrated line management system, iLNB, is the base for controlling the entire production line. It is not limited to Panasonic machines only, but inte- grates with third-party equipment, such as PCB handling systems, laser markers, AOI and SPI sys- tems, and reflow ovens.
Conventional systems require a number of PCs to control different machine types from differ- ent suppliers. The iLNB controls the entire line with only one PC. All collected information is transferred to a remote central computer. Small errors, such as pick-up errors, can be recovered from that central point.
Panasonic’s manufacturing operations opti-
mizer, MFO, creates detailed schedules for produc- tion and set up, calculating the required resources for production by simulating the entire manufacturing floor. MFO models multiple produc- tion lines and takes into account errors that may occur. Off-line set up can be adjusted to fit changes in staff and materials. MFO is available for the company’s NPM series, as well as CM, DT series machines and screen printers. It also supports equipment from other vendors.
PanaCIM Enterprise Edition is an extremely powerful system for inte- grated management of the entire SMT production floor. Comprising eight modules, the system can enhance quality and productivity, while reduc- ing costs. Each of the modules can be installed individually, depending on customer requirements. Modules include material control and verifica- tion, production control for changeover, traceability, analysis, monitoring, and maintenance.
MAF Offers Component Packaging Services
Frankfurt, Germany — HTV subsid- iary MAF Microelectronics Assembly Frankfurt is one of only a few European companies to offer elec- tronic component packaging and housing services. The company pro- vides sample production of premold packages and ceramic packages, packaging of mass production quan- tities in standard plastic and special packages for specific applications. The company’s services include: wafer cutting and dicing; chips in waf- fle packs; chip bonding and wirebond-
Panasonic is focusing heavily on digital services for the smart factory.
www.us-tech.com Panasonic Presents Smart Factory Solutions
The Enterprise link is the interface between PanaCIM EE and the customer’s MRP/ERP sys- tem for the export of all data collected by the sys- tem. PanaCIM EE is a multilevel manufacturing execution system that can be scaled to any compa- ny’s size. It supports applications from machine level to the cloud, automating processes across the enterprise and in manufacturing.
Panasonic’s NPM-WX is the next generation of the company’s component mounting machines. Through integrated automated systems, the NPM- WX machines offer greater line throughput and improved quality at lower cost. The series can han- dle a wide range of components, from 01005 (0402 metric) to a maximum size of 6 x 1 x 1.6 in. (15 x 2.5 x 4 cm), supplied in tape, stick and tray feed- ers. Four different placement heads are available. Maximum speed is 86,000 cph with an accuracy of ±1 mil (±25 μm). Contact: Panasonic Process Automation, 1701 Golf Road, Suite 3-1200, Rolling Meadows, IL 60008 847-637-9600
E-mail:
pfsamarketing@us.panasonic.com Web:
www.panasonicfa.com
See at SMT Hybrid Packaging, Booth 4-311
Page 79
MAF offers wafer dicing services, among many others.
ing; laser marking; electrical tests and lead inspection; packing in tray, tube and reel; quality inspections; and ASIC development. Contact: MAF Microelectronic Assembly Frankfurt (Oder) GmbH, Otto-Hahn-Strasse 24, D-15236 Frankfurt (Oder), Germany +49-0-335-38-719-63 E-mail:
maf@maf-ffo.de Web:
www.maf-ffo.de
See at SMT Hybrid Packaging, Booth 4-460
See at SMT/Hybrid Pkg, Booth 4A-536
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