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SMT/Hybrid ADM NY
Product Preview
Nordson ASYMTEK Intros Fluid Dispensing Platform
Carlsbad, CA — Nordson ASYMTEK has introduced its Helios™ SD-960 series automated dispensing system for medium- and high-volume deposits of one- (1K) and two-compo- nent (2K) materials for electronics manufacturing and PCB assembly. The Helios system is excellent
for depositing volumes greater than 0.03 fl oz (1 cc), and line widths and dots that exceed 0.04 in. (1 mm), but can deposit volumes down to 0.01 fl oz (0.3 cc) and line widths as narrow as 0.012 in. (0.3 mm). The system supports highly abrasive thermal interface materials (TIMs), epoxies and grease for such applications as potting, sealing, gasketing, and structural adhesives. The Helios system was made specifically to accommodate large
parts and substrates. The frame is 7.9 in. (20 cm) taller and the robotics are 5.9 in. (15 cm) higher than in conven- tional dispensing platforms for more
added vertical clearance for securely routing remote bulk-feed hoses and to accommodate larger valves and mix- ers. There are two conveyor options: standard chain or double- wide chain. A large purge container holds volumes up to 0.53 gal (2l). The Helios system can
Helios SD-960 automated dispensing system.
overhead clearance. An optional bulk fluid hose enclosure can provide
THE NEW
BENCHMARK IN WIRE STRIPPING
be equipped with Nordson ASYMTEK dispense valves or Nordson 1k- or 2k-meter- ing systems. When used with metering systems, the controls can be integrated so that the operator sees the metering system’s monitor from the same position as the machine control. This
allows the operator to focus on the dispensing area during operation. The system comes with Nordson
ASYMTEK’s Fluidmove® software, providing dispense programming con- trol in a familiar Microsoft Windows environment. Closed-loop controls main tain unparalleled control and
accuracy of the dispensing process. An optional needle sensor is available to monitor the positioning of large nee- dles that deliver bulk amounts and a laser height sensor automatically cal- ibrates for substrate height. A camera system enables programming and fiducial recognition, and an optional large-capacity, integrated weight scale provides mass flow calibration to ensure that dispense volumes remain within defined process limits through weight-controlled dispensing and auto matic calibration. The dispensing system accom-
modates a variety of bulk fluid sup- ply options. Various size reservoirs, fluid regulators, booster pumps, level sensors, and more can be selected to fit specific fluid and application
requirements. Contact: Nordson ASYMTEK,
2747 Loker Avenue West, Carlsbad, CA 92010 % 760-431-1919 fax: 760-431-2678 E-mail:
info@nordsonasymtek.com Web:
www.nordson.com
See at SMT Hybrid Packaging, Booth 5-434 Henkel: Non-Proprietary Solder Paste Analysis Toolkit
Irvine, CA — As device miniaturiza- tion and finer particle size solders become more mainstream, Henkel has developed a non-proprietary sol- der paste analysis toolkit to evaluate solder materials. While many suppliers and manu-
The
Mira 230 has a new robust and
sturdy design that supports an extraor- dinary processing range from AWG 32 to AWG 8. It sets a new benchmark by its unique sequencing capabilities that can be stored in a library for quick reproduction. The Mira 230 can strip and cut inner conductors with a variety of parameters without a program change. It comes equipped with a simple graphical user interface that ensures a quick learning process.
komaxwire.com
facturers use proprietary solder mate- rial evaluation tools, there is a require ment for easily implemented, standardized test vehicles that address the realities of today’s manu- facturing complexities, particularly in the process areas of printing and reflow. A cooperative effort
between industry special- ists in the disciplines of material formulation, sta- tistical evaluation and process engineering, the new solder test vehicle offers a turnkey solder evaluation tool. PCB de - sign, a complete bill of materials (BOM), full pro- gramming documentation, set up and test methods, and step-by-step directions for a designed experiment are all incorporated. Considering current and future
market requirements, the solder evaluation tool integrates area arrays down to 0.012 in. (0.3 mm) pitch, 0.016 (0.4 mm) pitch bottom- terminated components (BTCs) and a variety of discrete components from
1206s down to 008004s (3216 to 0201 metric). The unpopulated side of the board offers a design to evaluate slump, spread, solder balling, SIR, and print to fail (PTF). Balancing the 22 material prop-
erties to be tested along with BOM and labor costs, the PCB and test methods were intentionally engi- neered for efficiency, providing maxi- mum data, while minimizing the time investment. A user-defined scorecard that prioritizes various sol- der paste characteristics and weight- ings summarizes rating information
June, 2018
Solder materials test board. to indicate the best solder paste for a
specific operation. Contact: Henkel Electronic
Materials LLC, 14000 Jamboree
Road, Irvine, CA 92606 % 714-368-8000 E-mail:
doug.dixon@henkel.com Web:
www.henkel-adhesives.com
See at SMT Hybrid Packaging, Booth 4-241
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