June, 2018
www.us-tech.com
Page 87 Viscom Presents Smart Factory Inspection Solutions
Duluth, GA — Viscom is highlighting its new X7056-II inspection system, which offers a com- bination of in-line 3D AXI and AOI, at SMT Hybrid Packaging. Viscom is also exploring the topic of artificial intelligence (AI). One of the highlights at the show will be a CFX showcase in cooperation with IPC.
In live demonstrations, standardized Inter- net of Things (IoT) data from Viscom’s 3D sys- tems will be displayed in real-time on mobile phones or tablets.
The company is showcasing its develop- ment of AI and automation solutions. Col- laborating with Rethink Robotics’ Sawyer, Viscom is displaying how the X8011-II PCB MXI system can be loaded and unloaded auto- matically, without human intervention. AI is a concept that the company is dealing with in several areas, including com- puter-based verification of defects. These computational processes can be centralized for multiple lines and entire locations. There are many lev- els of independence between direct
TopLine
Offers CCGA Solder Joint Reliability Solutions
Irvine, CA — TopLine is now offering a range of CCGA solder joint reliabil- ity solutions, including CCGA col- umn grid arrays and daisy chain BGA test vehicles. TopLine’s column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on PCBs and provide more compliancy than BGAs, absorbing stress and increas- ing reliability in harsh operating con- ditions.
Solder columns can provide many benefits, including reducing
human decision making and a fully automated process. The operator can then edit only cases that the machines find to be ambiguous. Deep learning is playing an increasingly important role in the company’s program cre- ation and component assignment for new prod- uct introduction (NPI). Components are becom- ing easier to automatically recognize. AI is also contributing to optimized image quality, where algorithms improve the edge sharpness of an image, based on past experience. Contact: Viscom Inc., 1775 Breckinridge Parkway, Suite 500, Duluth, GA 30096 678-966-9835 fax: 678-966-9828 E-mail:
info@viscomusa.com Web:
www.viscomusa.com
X7056-II combined 3D AXI and 3D AOI system.
See at SMT Hybrid Packaging, Booth 4A-122
Column grid array IC package.
the stress caused by CTE mismatch when interconnecting area array packages and the PCB.
TopLine manufactures a wide range of daisy chain test compo- nents, column grid arrays, particle impact vibration dampers and engi- neering evaluation kits for process development, experimentation, ma- chine evaluation, solder training, and SMT assembly practice. Top- Line’s products provide hands-on learning for engineers. Contact: TopLine Corp., 95 Highway 22 W., Milledgeville, GA 31061 800-776-9888 E-mail:
sales@topline.tv Web:
www.topline.tv
See at SMT Hybrid Packaging, Booth 4A-120
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