June, 2018
www.us-tech.com
Page 73 Metcal Releases New Soldering Handpieces
Cypress, CA — Metcal is now offering its connec- tion validation (CV) hand soldering system with a set of new handpieces, as well as a digital hot air pencil and solder tip cleaner. Connection valida- tion is built on the same SmartHeat™ technology used in all Metcal soldering systems. CV evaluates the quality of the solder joint by
calculating its intermetallic compound formation and providing closed-loop feedback to the operator, mitigating risk in the process. The company is introducing a full set of handpieces, including tweezers, desolder and high thermal demand that will transform the CV-5200 soldering system into a complete rework solution. Metcal has also released its CV monitoring
software that improves solder process traceability and creates a performance baseline to quickly ana- lyze soldering performance, identify changes in solder conditions and allow the operator to make process changes. Metcal’s new digital hot air pen-
cil was developed for very small sur- face mount component and package
Aegis Presents “MES Digitally Remastered”
Horsham, PA — Aegis Software is showcasing the latest release of its Industry 4.0, digitalized MES soft- ware, FactoryLogix, at SMT Hybrid Packaging. The company is also par- ticipating in the show-wide, live, IPC Connected Factory Exchange (CFX) Internet of Things (IoT) demo. Industry 4.0 digital factory
operation requires three critical ele- ments. The first is the introduction of a new IoT-based industry standard for live and secure data exchange between machines and processes, IPC CFX. In its European debut at SMT Hybrid Packaging, data will be gathered live from multiple machines and vendors and made available to every show visitor through a mobile device dashboard that will display metrics and analyt- ic reports. The second element is to have
MES software that is specifically designed for Industry 4.0 and IoT technology. Aegis’ FactoryLogix soft- ware contains many new and improved functions over previous versions. These include the integra- tion of administrative quality man- agement, which combines corrective and preventive action (CAPA) with a failure reporting, analysis and cor- rective active system (FRACAS). The value of administrative
quality management is that unlike in-process tolls that ensure that every product is shipped without defects, administrative quality auto- mated corrections and continuous improvement procedures so that defects are avoided in the first place. The third critical element for
Industry 4.0 is the understanding of business case and operational goals that make use of the latest and greatest technology. Aegis’ experts are available to discuss Industry 4.0
business and strategy. Contact: Aegis Industrial
Software Corp., 5 Walnut Grove Drive, Suite 320, Horsham, PA 19044 % 215-773-3571 E-mail:
dgeiger@aiscorp.com Web:
www.aiscorp.com
See at SMT Hybrid Packaging, Booth 4-150
See at SMT/Hybrid Pkg, Booth 4A-100
For more information visit
www.rehm-group.com or call +1 770 442 8913
Strong performance with large components.
Meticulous protective coating.
Connection validation soldering system.
sizes, such as 1206 (3216 metric), and smaller. As components continue to shrink, e.g. 01005 (0402 metric), the shape of a pencil is more useful to access and rework components on a board without affecting adjacent parts. The company’s solder tip cleaner includes a
replaceable brush system that pulls excess solder away from the tip into a removable collection tray for disposal, while removing oxidation from the tip. Solder tips represent a significant portion of the cost of ownership of a solder station, and Metcal’s solder tip cleaner is designed to extend the life of the solder tip. By placing the tip into the opening, the AC-STC solder tip cleaner senses it and auto-
matically activates. Contact: Metcal, 12151 Monarch Street,
Garden Grove, CA 92841 % 714-799-9910 E-mail:
jsimmons@metcal.com Web:
www.metcal.com
See at SMT Hybrid Packaging, Booth 4-101
the perfect result.
Turn Vision into Reality ready for the next step
Rehm presents innovative solutions for the “Next Generation” in mechanical engineering
Every year, SMT hybrid packaging addresses current topics related to electronics manufacturing and puts fourth industrial revolution and smart factory. Rehm will be presenting innovative solutions for augmented reality that are an important part of the new ViCI virtual communication interface for the ViCON system
SMT
Hybrid/Packaging Nuremberg
June 5 – 7, 2018 Hall 4A
Booth 100
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104
