June, 2018
www.us-tech.com
Page 25 Rush PCB Manufactures 10-Layer HDI Boards
San Jose, CA — Rush PCB is now offering design and manufacturing capabilities for multilayer, high-density interconnect (HDI) PCBs of 10 layers or more. To achieve very high density interconnec- tion, designers at Rush PCB use every layer inter- connect (ELIC) technology. Each layer of the PCB has its own copper-filled,
laser-drilled micro-vias. When the layers are stacked, this provides dynamic interconnection be- tween any two layers in the PCB, offering increased levels of flexibility and maximizing circuit density. Rush PCB’s designers have taken up addition-
al complex challenges in routing with via-in-pad (VIP) and using blind and buried vias. The company laser-drills via holes and fills them with conductive copper paste. Before finalizing the design of multi- layer PCBs, the company confirms the structure of the circuit board based primarily on its scale, phys- ical size and the EMC requirements. The company’s designers use 10
layers of material and carefully plan the inner layers and the manner of distribution of different signals through the PCB. This determination of the stack up beforehand saves the user time and effort in wiring and production. Apart from very fine traces in
the foil pattern, HDI requires se- quential build up (SBU) and micro- vias drilled with lasers. The HDI lay- ers are usually built up from a tradi-
Epoxies, Etc. Introduces Thermally Conductive Epoxy
Cranston, RI — Epoxies, Etc. has de- veloped a new fast-curing, alu- minum-filled epoxy adhesive, 70- 3814. This thermally conductive ad- hesive exhibits 1,000 psi of strength after only four hours. After 24 hours, its lap shear strength is 2,900 psi. The epoxy adhesive offers fast
heat dissipation for a wide range of as- sembly applications, providing a ther- mal conductivity of 1.8 W/m-K. The quick heat dissipation makes the ma- terial a popular choice for many heat sink bonding applications. The prod-
tionally manufactured, double-sided core board or multilayer PCBs. Rush PCB is a printed circuit design, fabrica-
tion and assembly company located in the heart of Silicon Valley. The company offers small produc- tion runs and prototypes as well as full-scale pro- duction, using both manual and automated SMT assembly processes when appropriate. RUSH can execute single and double-sided placement for all SMT component types, including BGA, UBGA, QFP, QFN, PLCC, SOIC, POP, and various other small chip packages. The company can handle pas- sive chip packages as small as 008004 (0201 met- ric), and active components with pitches of 8 mil
(0.2 mm) or more. Contact: Rush PCB, Inc., 2149029
High-density interconnect (HDI) printed circuit board.
O’Toole Avenue, San Jose, CA % 408-496-6013 E-mail:
roy@rushpcb.com Web:
www.rushpcb.com
LED Big Board Solution
70-3814 is available in TriggerBond cartridges.
uct is offered in the company’s conven- ient TriggerBond® cartridge system. Key features include: strong
bond strength that develops quickly; thermally conductive adhesive that transfers heat quickly; packaged con- veniently; and vibration and impact resistance that helps to hold parts to- gether in harsh environments. Epoxies, Etc. has been formu-
lating solutions for electronic circuit- ry and assemblies for more than 30 years. The company’s chemists and engineers are able to provide specific application support and samples are
readily available. Contact: Epoxies, Etc., 21 Star-
line Way, Cranston, RI 02921 % 401-946-5564 fax: 401-946-5526
E-mail:
sales@epoxies.com Web:
www.epoxies.com
See at SMT/Hybrid Pkg, Booth 4A-318
smt.hanwhatechwin.com
Production class assembly equipment for 24”, 28”, 48”, 59” PCB form factors includes high performance printing, precision component mounting, repeatable reflow, and reliable board handling with expert training, service and support.
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