April/May, 2024
www.us -
tech.com Thermaltronics to Unveil Solder Robot
GREAT NECK, NY — Thermal - tronics USA, Inc., is unveiling its latest innovation, the TMT- R9000S solder robot. As the solder robot market experiences rapid growth, fueled by skilled labor shortages and heightened auto - mation demands, Thermal tronics is at the forefront, addressing industry needs with cutting-edge solutions.
Designed as a compact and versatile benchtop unit, the
CHT to Showcase Silicone Expertise
RICHMOND, VA — CHT is high- lighting next-generation light- weight silicone solutions that benefit recent trends in electronic and transportation applications at IPC APEX 2024. The team will showcase its
latest product developments in - cluding a silicone foam designed to reduce weight, mitigate ther- mal runaway, and provide protec- tion especially in electronics, EV/ batteries/automotive manufactur- ing. CHT will run live product demonstrations with this formula- tion during the show. The company also offers a
lightweight silicone potting com- pound, SE2014, which features a low specific gravity (SG) of just 0.73 g/cm3 which reduces weight by approximately 15% when com- pared to similar encapsulants. With low outgassing, low SG and UL94-HB approval, engineers can design components that are lighter while not having to compromise on performance, safety or the integri- ty of the finished product. Also available is a thermally
conductive 1-part RTV silicone adhesive, AS1811, for use with sensitive electronic components. In addition to bonding compo- nents and enclosures, it will effec- tively dissipate heat without any harmful by-products. With the added benefit of UL 94 V-0 approvals and low volatiles it makes this the perfect choice for every electronics design engineer. Finally, SilSo Clear 21002 is
an optically clear liquid silicone rubber design for injection mold- ing applications. Due to its non- yellowing properties, this product is ideal for optical applications such as lenses, lightguides and LEDs. It is highly resistant to ultraviolet (UV), temperature and moisture.
Contact: CHT, 7820
Whitepine Road, Richmond, VA 23237 % 804-221-4611 E-mail:
matt.loman@cht.com Web:
www.cht.com
See at IPC APEX, Booth 442
nordson.com/testinspect | +1 760.918.8471 Copyright © Nordson Corporation. All rights reserved.
TMT-R9000S is well-suited for a diverse array of applications. The incorporation of SMEMA Communication Ports enables seamless integration with Ro - botic Arm Systems, expanding its automation capabilities. With a soldering area measuring 12 x 12 in. (308 x 308 mm), the TMT- R9000S delivers precision and flexibility in soldering applica- tions. Accommodating a maxi- mum PCB area of 17 x 17 in. (450 x 450 mm), this solder robot is adept at handling versatile sol- dering tasks. Noteworthy features include
XYZ 3D soldering and 3D dis- pensing capabilities, ensuring
accuracy and consistency in com- plex soldering tasks. The avail- ability of two input line voltage options, TMT-R9000PS-1 (100- 110 VAC) and TMT-R9000PS-2 (220-240 VAC), adds to its versa- tility. With a six-axis servo motor axis, the solder robot pro- vides control and precision in sol-
dering operations. Contact: Thermaltronics
USA, Inc., 1 Barstow Road, Suite P19, Great Neck, NY 11021 % 516-829-2726 E-mail:
info@thermaltronics.com Web:
www.thermaltronics.com
TMT-R9000S solder robot. See at IPC APEX, Booth 1003
Page 97
WX3000™ M
WX3000™ Metrology and I ev
ology and Inspection Systems for Wafafer-Level and Advanced Packaging
Seriously Fast. tio
dvanc Copper Pillar
Micro Bump
Flip Chip (c4) Powered by
Multi-Reflection Suppression® (MRS®) Technology
BGA Ball
2-3X Faster with High Resolution and High Accuracy WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and processes.
Powered by Multi-Reflection Suppression (MRS) Sensor Technology The 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer) MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as 25-micron.
Ideal for wafer bump metrology, solder on wafer metrology and for measuring photoresist and plating uniformity to improve the plating process.
100% 3D and 2D metrology and inspection can be completed simultaneously at high speed (25 300mm wafers/hour and 55 200mm wafers/hour) as compared to a slow method that requires two separate scans for 2D and 3D, and only a sampling process.
See at IPC APEX, Booth 1815
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