April/May, 2024 Continued from previous page


dering jobs can be carried out without switch- ing off the station. For optimal heat transfer and to main-


tain joint quality, it is important to keep the tip clean, tinned and free of oxides. JBC’s tip cleaning system allows manufacturers to choose from three safe methods according to their needs — metallic wool, sponge or metal brush. The integrated wiper also allows excess solder to be removed from the tip sin- gle-handedly. JBC has more than 500 models of car-


tridges of different sizes and shapes for every application, from high-precision jobs to high- power applications. The larger the contact surface that the tip


Are Your Electronics Protected?


Continued from page 49


low coefficient of thermal expan- sion (CTE) to limit warpage and stress, excellent temperature stability, and are a low-cost solu- tion.


However, the materials and


processing must be tightly con- trolled to keep the dispensed encapsulant free of voids. Underfills are polymer-based materials that improve the relia- bility of arrayed components (BGAs, CSPs, flip-chips, etc.) or bare die by protecting intercon- nects from thermo-mechanical damage induced through CTE mismatches between the compo- nent and the substrate, especial- ly during thermal cycling. Following solder reflow and


the formation of the electrical interconnects, underfill material is dispensed along one or two edges of the component, after which it flows underneath by capillary force between and around the solder joints to encap- sulate and protect the device from thermal cycling and/or mechanical stress. The process is fast but requires a heat cure.


Protection = Reliability Securing electronics for


long-term, dependable perform- ance typically requires that many protective materials be used in combination — a confor- mal coating, an underfill, and a potting material, for example. Therefore, working with a sup- plier that has expertise in multi- ple safeguarding strategies and formulations, and understands various material compatibilities helps ensure the most cost-effec- tive and reliable solution — no matter the application. Contact: Henkel Corpor -


ation, 14000 Jamboree Road, Irvine, CA 92606 % 714-368-8000 Web: www.henkel-northameri- ca.com r


See at IPC APEX, Booth 3514


www.us - tech.com Optimized Hand Soldering and Rework


has with the application, the higher the ther- mal transfer. A better thermal transfer allows faster soldering. A tip with high-thermal effi- ciency makes the job up to 40% faster than a tip with a slimmer geometry. For example, avoid using double cone tips unless necessary for difficult-to-reach solder points.


Keep in mind that rusty and dirty surfaces


reduce heat transfer to the solder joint. Periodically clean the tip to achieve optimal thermal transfer. In general, the larger the tip mass, the easier the solder joint is made. Large tips facilitate high thermal transfers rates, reducing the time required for a solder joint. This allows for: lower working tempera-


tures; better results in less time; improved thermal performance; increased temperature precision; and reduced collateral damage. Contact: JBC USA, 9296 Dielman


Industrial Drive, St. Louis, MO 63132 % 866-429-5753 E-mail: usa@jbctools.com Web: www.jbctools.com r


An array of tips. See at IPC APEX, Booth 3642


Page 51


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