April/May, 2024
www.us -
tech.com Essemtec Showcases All-in-One Platforms
WALTHAM, MA — Essemtec is showcasing its flagship all-in-one platforms — FOX and PUMA at IPC APEX 2024 The machines will be
equipped with the latest innova- tions in solder jetting, integrated inspection system, smart materi- al management, as well as 0.16 in. (4 mm) EVO feeder — 08004 pick-and-place. The all-in-one platform will
demonstrate the highest stan- dards in electronics assembly on flexible substrates, jetting of multiple fluids and efficient rework on populated boards. Essemtec its also presenting
KIC Presents Contact-less Thermal
Analysis SAN DIEGO, CA — In response to the dynamic demands of today’s manufacturing environ- ment, where maintaining the highest level of quality and process control is paramount, KIC proudly introduces new sen- sor technology. This ground- breaking technology, Contact- less Thermal Analysis™, directly measures board temperatures during production, marking a revolutionary advancement in electronics manufacturing. KIC’s new, revolutionary
Contact -less Thermal Analysis directly measures board temper- ature at the end of the heated section of the reflow oven during production. This
capability
enables real-time monitoring of temperature and convection changes, representing a monu- mental leap in reflow process inspection technology. Directly measuring board
temperature and heat transfer changes ensures unparalleled precision and quality in reflow profiles, monitoring all aspects of the oven’s influence on produc- tion boards. KIC RPI employs advanced
algorithms, considering board temperature and ambient tem- perature at the board level, to determine temperature, time, and convection changes impact- ing the reflow profile. The RPI system actively
tracks process Cpk, providing critical temperature profile data that seamlessly integrates with other MES factory automation
systems, SPI, and AOI data. Contact: KIC, 16120 W.
Bernardo Drive, San Diego, CA 92127 % 858-673-6050 E-mail:
abailey@kicmail.com Web:
www.kicthermal.com
See at IPC APEX, Booth 1626 See at IPC APEX, Booth 1200 Bond Wire Analysis Electronics Inspection
its agile dispensing platform on the TARANTULA machine. The machine can be equipped with five different valves, for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam, and underfill. The company’s in-house
rapid prototyping solution will be demonstrated on the DragonFly 3D printer of Nano Dimension and Essemtec FOX equipment with the combined dispensing and components placement capabilities. An increased solder jet
speed of 180,000 to 400,000 dots/h can be achieved. It is now possible, with the new increased speed and accuracy, to exchange inflexible traditional solder paste screen printers with a P&P inte-
grated solder paste jetting solu- tion to serve multiple machines in a highly flexible line solution. End users gain the flexibility to solder jet products and place components in the all-in-one sys- tems or dedicated high-speed dispensers for volume produc- tion, integrating the system for
process improvement capability. Contact: Essemtec USA,
300 5th avenue, Waltham, MA 02451 % 856-218-1131 E-mail:
essemtec.sales-usa@
nano-di.com Web:
www.essemtec.com
Solder paste jetting. See at IPC APEX, Booth 2409
Page 61
Real-time Inspection
BGA Inspection
High-resolution X-ray Technology Revolutionizing Electronics Inspection
• Nikon proprietary X-ray source with unlimited life cycle • Source collimation for protection of radiation sensitive electronics
• CT-grade amorphous-silicon digital detector with true 16-bit analog to digital converter
• Largest field-of-view detector in the industry • Fastest, most advanced 3D CT and laminography reconstruction • Available in 130 kV and 160 kV
APEX EXPO 2024 1 (800) 552-6648
APEX EXPO 2024 Visit Us at Booth #1200
www.industry.nikon.com
sales.nm-us@nikon.com
April 9 - 11, 2024
Scan for more info
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