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WEST CONSHOHOCKEN, PA — Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.
Heraeus Partners with SUSS MicroTec X2F and Kerafol
It complements the broad product portfolio of Heraeus to the elec- tronics industry. The Prexonics® technology enables selective print- ing on different substrates for a wide range of applications such as shielding against electromagnetic interference (EMI), printing of conductive structures and metallization for heat dissi- pation. “This collaboration rep-
Executives from Heraeus and SUSS MicroTec sign a JDA.
The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the elec- tronics industry for the first time. Heraeus Printed Electronics,
the only worldwide provider of a turnkey solution for digital inkjet printing on electronic components, offers metallic inks, deep process knowledge and printing systems.
resents the missing piece in the mosaic of scaling to mass production for us, having re- cently passed the important milestone of fulfilling the broad functional require- ments of the semiconductor
industry with our ground- breaking technology,” said
Franz Vollmann, head of Heraeus Printed Electronics. “By combin- ing our core expertise in metallic specialty inks and digital printing processes with the scaling compe- tence of our strong partner, SUSS MicroTec, we are setting a new in- dustry standard for mass produc- tion in the semiconductor market.” SUSS MicroTec, known for its advanced equipment and process
DALLAS, TX — StenTech has completed a major technology update to its Photo Stencil Specialized Products Division in Golden, Colorado. The phase one overhaul included upgrades to key areas, in- cluding imaging, chemical plating, metrology, and chemical coating, along with refreshed offices and board room. “We have invested a substantial amount of time,
energy, and funds to upgrade this vital facility,” said Brent Nolan, CEO of StenTech. “Photo Stencil is the leading provider of complex electroforming precision paste, flux, ball-drop, wafer bump, and 3D stencils and screens. We offer cutting-edge products with mi- cron-level precision and a wide range of specialized solutions, techniques, and materials not available elsewhere in North America.” A key element of this facility upgrade is the in-
troduction of StenTech’s latest innovation in stencil coating technology — the all-new StenTech
solutions for semiconductor manu- facturing, brings its leading-edge automation platform and industri- al inkjet production capabilities to the table. Their high-volume pro- duction equipment, JETx, de- signed to integrate various print- head and substrate technologies, expands the application potential of Heraeus’ digital printing tech- nology. SUSS MicroTec’s high pro- duction capacity and excellent global sales and service network support the smooth transfer of the solution into high-volume manu- facturing. The scope of the collabora-
Business news Collaborate
www.us-tech.com April/May, 2024
tion calls for the development of equipment that integrates Her- aeus’ digital printing technology, image processing software and advanced ink technology into SUSS MicroTec’s automation
and JETx platform. Contact: Heraeus, Inc., 24
Union Hill Road, West Con- shohocken, PA 19428 % 484-391- 2511 E-mail: tracey.quinn@her-
aeus.com Web: www.heraeus-
electronics.com r
See at IPC APEX, Booth 3912 StenTech Updates Colorado Facility
BluPrint™ CVD (Chemical Vapor Deposited) surface treatment. Engineered to enhance SMT processes, this advanced coating offers a comprehensive set of benefits that collectively contribute to improved sten- cil performance, longevity, and the overall quality of the SMT assembly process, streamlining production. In the SMT industry, precise stencils and tool-
ing are indispensable. These components demand meticulous design and prompt delivery, leaving no room for compromise on quality, speed, or reliabili- ty. Any issues or delays can lead to substantial costs in an environment where timing is para- mount, and faults are expensive. StenTech’s Photo Stencil division excels in offering unmatched qual-
ity, specialized products and reliability. Contact: StenTech, 8350 N Central Express- way, Suite 416, Dallas, TX 75206 % 603-505-4470
E-mail:
info@stentech.com Web:
www.stentech.com r
See at IPC APEX, Booth 1608 NEOTech Certifies Suzhou Site
CHATSWORTH, CA — NEOTech’s manufacturing site in Suzhou, China, is now certified to IATF 16949, the international standard for automotive quality management systems. This certification marks a significant milestone
for the company, allowing it to expand its high-tech industrial focus to include automotive products, such as electronic automobile diagnostic tools and emission measuring units. The attainment of the IATF 16949 certifica-
tion underscores NEOTech’s commitment to deliv- ering high-quality electronic solutions across a di- verse range of industries. By meeting the stringent requirements of this internationally recognized standard, NEOTech reaffirms its dedication to
manufacturing excellence and customer satisfac- tion in the automotive sector. The IATF 16949 certification will play a cru-
cial role in guiding NEOTech’s Quality Manage- ment System, ensuring the company’s continued adherence to the highest standards of quality and reliability in automotive electronics manufactur- ing. By leveraging this certification, NEOTech aims to enhance its ability to produce repeatable, high-reliability systems that meet the stringent re-
quirements of automotive OEMs worldwide. Contact: NEOTech, 9340 Owensmouth
Avenue, Chatsworth, CA 91311 % 818-495-8617 E-mail:
steve.bates@
neotech.com Web:
www.neotech.com r
LOVELAND, CO — Kerafol and X2F are teaming up to develop state-of-the-art thermal manage- ment solutions for electronic de- vices by leveraging the advan- tages of Kerafol’s thermally con- ductive materials and X2F’s patented controlled-viscosity mol - ding technologies. The partner- ship aims to provide advanced thermal management solutions that meet the ever-increasing high-performance demands of the electronics industry. Combining Kerafol’s high-
performance thermoplastic elas- tomeric materials with X2F’s controlled-viscosity molding (CVM) technology delivers a higher-performance alternative to conformal coating, potting, and sealing of electronics, achieving superior environmen- tal protection and heat dissipa- tion while reducing processing times and manufacturing costs. This collaboration ensures
long-term reliability by safe- guarding against contamination, vibration, shock, ESD, and ther- mal stresses, all in a stream- lined, one-step process. This comprehensive single-
step environmental protection so- lution
reduces complexity
through out the supply chain. It simplifies manufacturing, ware- housing logistics, and production processes while enhancing long- term reliability. The partnership has introduced cutting-edge tech- nology to the market, integrating high-performance thermal materi- als with CVM technology, provid- ing manufacturers with cost-effec- tive solutions that ensure high re-
liability in electronic systems. Contact: X2F, 985 N Wilson
Avenue, Suite 100, Loveland, CO 80537 % 877-572-2662 E-mail:
mslowik@x2f.com Web:
www.x2f.com r
Download our 2024
Media Kit Visit us at
www.us-tech.com
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