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April/May, 2024


Are Your Electronics Protected? That Depends.


By Kris Machiels, Application Engineer, Henkel Corporation T


he electronic content in a current-gen- eration automobile, a modern smart home, entertainment devices and many


other products that make up our digital exis- tence is significant. For the average vehicle built today, approximately 40% of its cost is derived from electronics, and that figure is


and safety. Protecting them is non-nego- tiable.


With various safeguarding approaches


from the PCB level to the components to the entire assembly, it is sometimes difficult to know what protection materials to use. What is the most durable? The most cost-effective? The answer is: that depends. Material


selection —or a combination of materials —is contingent on many factors, including the kind of electronics being protected, the appli- cation, the reliability requirement, risk of exposure to certain environmental harms, and lifetime expectation.


Protection Materials


Liquid potting materials are formulations that can be dispensed or poured to encapsu- late complete electronic assemblies. They harden after cure to hold all elements in place and protect devices from shock, vibra- tion, liquids, chemicals, and other damaging elements. They are generally employed for extreme environments and with electronics in an enclosure. One- and two-part potting materials are


Smart meter teardown.


expected to be as much as 50% over the next decade.


Designing and manufacturing electronic


devices comes at a significant cost. Using them requires confidence in their reliability


available in multiple chemistries (silicones, urethanes, and epoxies) and are dispensed onto the electronics and within the housing, then cured. The process is relatively fast, with maximum protection delivered. This provides enhanced mechanical strength, electrical insulation, heat dissipa-


Liquid potting. This encapsulation protection method is


ideal for exposed electronic assemblies that require delicate processing, fast and efficient manufacturing, and a clean, sustainable


Continued on next page


tion (some formulas), corrosion and chemical protection, shock and vibration resistance. However, potting is typically permanent


and not reworkable. Potting is a more pro- longed process compared to methods that use other encapsulating materials like low-pres- sure molding.


Low-pressure molding (LPM) materials provide an overmold to create a self-con- tained electronics housing and can be used across a wide variety of applications — from small electronic devices to LEDs to connec- tors, cables, and wires.


COMPACT. EFFICIENT. SILENT. INFUSED BY INNOVATION.


WE meet @ embedded world Hall 2-110


State of the Art Power Modules The MagI³C FIMM Fixed Isolated MicroModule series com- bines the features of an isolated power module with those of a classic MicroModule. It is realized in an LGA-7 housing and impresses with its miniaturized dimensions. The 1 W output power can be provided up to an ambient temperature of TA = 100 °C without derating. Features like continuous short circuit protection (SCP) and dynamic power boost up to 300 mA for 500 ms ensures a robust performance for in- dustrial applications. The module complies with EN55032 (CISPR-32) class B conducted and radiated emissions stand- ard and requieres no external components for operation.


www.we-online.com/INFUSEDBYINNOVATION


• LGA-7 housing (9 mm x 7 mm x 3.1 mm) • Ambient temp range from -40 °C to +125 °C • Typ. 8 pF parasitic coupling capacitance • Efficiency up to 91 % • Certified according UL62368-1 • Dynamic and static power boost


#FIMM


© eiSos


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