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April/May, 2024 Fuji Unveils AIMEXR Placement System
VERNON HILLS, IL — Fuji America has unveiled its latest innovation in advanced manufac- turing technology, the AIMEXR placement system. Engineered to redefine production efficiency and quality, the AIMEXR represents a significant leap forward in manu- facturing capabilities.
imbalances and maintaining optimal production efficiency. Powered by real-time sens-
ing technology, the AIMEXR guarantees stable and high-quali- ty mounting processes. By contin- uously monitoring the status of electronic components and boards, it ensures proper mount-
and maximizing availability. Its innovative features, including automatic data logging and offline maintenance capabilities, ensure swift issue resolution and seam- less continuity of operations. The AIMEXR incorporates energy-efficient motors, reducing power consumption by 10%. Furthermore, Fuji is actively reviewing its coatings to mini-
mize environmental impact,
underscoring its dedication to eco-friendly manufacturing prac- tices.
Contact: Fuji America
Corp., 171 Corporate Woods Parkway, Vernon Hills, IL 60061 % 847-913-0162 E-mail:
info@fujiamerica.com Web:
www.fujiamerica.com
See at IPC APEX, Booth 720
TopLine, TANAKA Co-Exhibit at IPC APEX
AIMEXR placement system. The AIMEXR boasts en -
hanced responsiveness, capable of handling large connectors, heavy parts, and boards prone to warping. Despite its compact size, this cutting-edge equipment offers a wide range of capabili- ties, facilitating flexible and effi- cient production operations. The adoption of the latest mounting head technology ensures high adaptability in actual production scenarios, suppressing line
ing conditions at all times, result- ing in superior product quality. With the integration of lin-
ear motors, the XY robot of the AIMEXR achieves the fastest mounting speed in the history of the series. This breakthrough not only enhances productivity but also sets new benchmarks for area efficiency. The AIMEXR is engineered
to support uninterrupted produc- tion, minimizing line stoppages,
MILLEDGEVILLE, GA — TopLine Corporation will co- exhibit with Tanaka Precious Metals at IPC APEX 2024. TopLine will display CCGA, BGA, daisy chain test compo- nents as well as bonding wire by Tanaka Precious Metals. TopLine manufactures a
wide range of solder columns for CCGA semiconductor packages, and provides daisy chain CCGA packages for engineering devel- opment, profiling and practice. TopLine products provide hands- on learning for engineers. TANAKA Precious Metals
specializes in quick delivery of bonding wire for IC modules and battery interconnects, including round wire and flat ribbon from USA domestic stock for next day delivery; this includes gold, alu-
minum, silver, copper, and plat- inum for military/aerospace, other semiconductors and dis- crete semiconductors, ICs, sen- sors, and input devices.
TANAKA gold bonding wire. Contact: TopLine Corp.,
95 Highway 22 W, Milledgeville, GA 31061 % 800-776-9888 E-mail:
sales@topline.tv Web:
www.topline.tv
See at IPC APEX, Booth 1231
Accurately Dispense Two-Component (2K) Material with Dual PC Pump TS8200D Micro-Meter Mix
100:1 2 Mix & dispense 2-component material +/-1% 1:1
to +/- 1%
Mix ratios between 1:1 and 10:1
of material
cross-contamination
· Suck-back action to prevent material dripping · Optional sensor to monitor back pressure
See Micro-Meter Mix and other Techcon innovations at IPC APEX Booth 3646
See at IPC APEX, Booth 3646
and maintenance
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