July, 2021
www.us-tech.com
Jet Printing with Modular Dispensing Systems Continued from previous page
and-place spindles and jet printing as in the Essemtec Fox2 pick-and-place platform. Combined with edge conveying, this means that a substrate can enter the system bare, and exit with both solder paste and circuit elements mounted. With solder paste jetting integrated into
the process a separate machine is not neces- sary, saving space on the manufacturing floor as well as cost. Jet printing also reme- dies many of the difficulties associated with screen printing. While the jetting system’s fluid path must be cleaned occasionally, this is only periodically required as opposed to the daily cleaning of stencils. Jetting valve components are also very
small, vastly reducing the stor- age space needed when com- pared with stencils. Due to the precise and small amount of sol- der paste being dispensed, the need for the disposal of unneces- sary solder paste is eliminated. Jetting systems are also
extremely versatile. The valves are fully programmable, and when integrated into a user interface that complements them, switching jetting parame- ters and outcomes can be as easy as pushing a button. While stencils can only be
used for one application, a jetting valve can be repurposed as many times as a customer needs, by writing a new program for each circuit layout. Jetting systems are completely modular and can be modified and reset for new applications. Important, jetting valves
can be used to dispense onto products with protrusions as they can be freely moved along the z axis of a motion platform, providing the advantage of flexi- ble and contact-free dispensing. This flexibility can extend to
entire production lines, as one machine can be used solely for jet printing while the next can be used solely for placement. Because jetting and pick-and- place speeds are similar, the right programming can enable two machines to become a contin- uous line of production. In addition to their conven-
ience, jetting systems are also extremely precise and can jet dots below 200 microns in diame- ter with the correct parameters. This leads to performance from jet printing that matches or exceeds screen printing with stencils, while avoiding the waste associated with it. The MDS 1560 jetting sys-
tems are not only highly modular, but they also offer a large range of different tappet and nozzle inserts of varying sizes, materials and weights. By changing these parts, a jetting solution can be found for almost any dispensing application.
Different Strokes VERMES Microdispensing
has two different jetting tech- nologies available: piezo and
DST. Piezo jetting engines use the piezoelec- tric effect to move a tappet a very small dis- tance, or stroke, up and down to jet. Dynamic Shockwave Technology (DST)
enables the jetting engine to move the tappet a longer distance at a higher speed. While piezo-based systems can run at a higher fre- quency than DST-based systems and tend to be more precise for obtaining very small dot sizes, DST was created specifically for jetting solder paste. This is due to the stroke being longer
than piezo strokes, while exerting less tap- pet-to-nozzle force. Piezo engines can occa- sionally crush larger solder balls with the tappet, due to this high striking force, while DST does not. This results in piezo being more suited
Page 53
for jetting high-viscosity liquids at smaller dot diameters, while DST is uniquely suited to jetting solder paste. Jet printing solder paste introduces a
wide variety of benefits to specialized SMT production or companies looking for a modu- lar alternative to screen printing. Although Jet printing cannot match the speed of screen printing, the convenience with which it can be used and modified is unmatched, and the reusability of jetting systems for many differ- ent applications over a long period of time can be indispensable. Contact: VERMES Microdispensing
America, Inc., 2226 Ringwood Avenue, San Jose, CA 95131 % 408-520-2555 E-mail:
patrick.miron@vermes.com Web:
www.vermes.com r
Vacuum Tweezer™ Solutions
For over thirty years we have been a leading supplier of vacuum handling solutions to the world’s high technology
fi rms. Our patented ESD safe products are used by clean room personnel, electronic assemblers, semiconductor manufacturers, the optics
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developing innovative vacuum tweezer tools to eliminate part damage and increase productivity in pick and place operations throughout high tech industries.. These tools provide customer specifi c solutions that make assembly and processing operations more productive and ergonomic. Parts range in size from 0.004” (0.1mm) up to 12.0” (300mm) for easy handling.
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