search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Page 34


www.us-tech.com


March, 2020


IPTE Depaneling Stress-free Production


EXPERTS IN FACTORY AUTOMATION


Reactive Resin Systems for Electronics from RAMPF


Wixom, MI — RAMPF Group has in- troduced reactive resin systems, based on polyurethane, epoxy and silicone. The company’s portfolio in- cludes liquid and thixotropic sealing systems, electro-casting resins with high thermal conductivity, perform- ance materials, elastomers, and ad- hesive systems. To protect the electronic


Low stress High quality output


Routing and/or sawing Reduced investment


EasyRouter off-line, low volume


TopRouter off-line, medium mix


Automatic tool change Long autonomy


Fast cutting speed High output


Clear cut Outstanding quality


High performance Best return on investment


components of control centers from dust, liquids and other in- fluences, RMPF has developed high-performance


sealing


foams that consist of polyurethane (RAKU® PUR) and silicone (RAKU SIL) sys- tems for indoor and outdoor ap- plications. The two-component materials are UL-, NEMA- and ATEX-approved. Features include: IP67,


The company also offers mixing


and dispensing technology for foam- ing, sealing, casting and bonding sin- gle-, dual- and multicomponent reac- tive resin systems. Compact dispens- ing cells and robots, set up with high- performance controllers from Siemens or Beckhoff, meet challeng- ing requirements.


RAMPF offers automated integrated dispensing technology.


68, etc., classification; suitability for indoor and outdoor use, strong abra- sion surface, chemical resistance, ad- hesion to different materials, fast curing, handling and assembly.


FlexRouter II in-line, high volume, high mix


SpeedRouter in-line, high volume


IPTE America LLC 5935 Shiloh Road East - suite 100 Alpharetta GA 30005 USA T: +1 (0) 678 807 0067 x101 F: +1 (0) 678 807 0072 E: sales.usa@ipte.com


IPTE America LLC 6245 Shiloh Road East, Suite B Alpharetta GA 30005 USA T: +1 (0) 678 807 0067 x 101 F: +1 (0) 678 807 0072 E: sales.usa@ipte.com


WWW.IPTE.COM Contact: RAMPF Group, Inc.,


49037 Wixom Tech Drive, Wixom, MI 48393 % 248-295-0223 E-mail: info@rampf-group.com Web: www.rampf-group.com


Creative Materials: New Fast Curing Conductive Adhesive


Ayer, MA — Creative Materials has introduced its 128-17A/B, a fast-cur- ing, electrically conductive adhesive. The new product is a two-component, silver-filled adhesive that cures at room temperature. After mixing the components, its


working life is five minutes at 77°F (25°C) and it can be handled in 30 minutes. Typical end uses include electrical and mechanical attachments on electrical components and devices. A key feature is a fast set-up


time, which allows for rapid process- ing and repair in a variety of applica- tions. The new adhesive exhibits ther- mal stability up to 356°F (180°C) and tensile strength greater than 400 psi. Creative Materials designs, de-


velops and manufactures specialty electronic inks and adhesives. The


128-17A/B conductive adhesive. Contact: Creative Materials,


Inc., 12 Willow Road, Ayer, MA 01432 % 978-391-4700 E-mail: info@creativematerials.com Web: www.creativematerials.com


company holds both ISO 9001 and ISO 14001 certifications. All prod- ucts are manufactured in the U.S.


Hermetic Package Encapsulation


– Development and Production – Automatic Gross and Fine Leak Testing – Weld or AuSn Cover Seal


Guaranteed 0 gross leakers with fine leak rates + decade lower than space level.


Low Temperature Processing; Feedthroughs in Cover and Package.


Learn more | 610.228.0161 | microcircuitlabs.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100