December, 2020
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Ensuring Functionality and Reliability through High-Quality Packaging
By Annemarie Maletic, MAF Microelectronic Assembly P
roper packaging is an essential part of any finished component, as it must protect the sensitive silicon and bonded joints from vary-
ing temperatures and environmental conditions. MAF Microelectronic Assembly Frankfurt
(Oder) GmbH, a subsidiary of HTV, is a specialist in the packaging and assembly of microelectronic cir- cuits. From wafer dicing and die bonding to finished packaged components, MAF offers comprehensive services for the entire packaging process, certified to DIN EN ISO 9001:2015. High-quality packaging is indispensable to
ensure correct, long-term functionality and relia- bility of the component, and as a result, the entire device.
Wafer Processing In wafer processing, tested and
thinned wafers are strained on an elastic foil. After high-precision dic-
High-quality packaging is indispensable to ensure correct, long-term func-
tionality and reliability of the component, and as a result, the entire device.
ing, the die are sorted based on an electronic wafer map. A handling sys- tem then picks up the individual die from the foil and either places them in a waffle pack or attaches them to the required lead frame with various chip adhesives. Special lead frames can be
developed and manufactured accord- ing to customer requirements. The company can integrate several chips, as well as entire functional group or groups of components, into a single package. This is followed by subsequent
wirebonding with thin gold wires, which is performed by a fully automat- ed system. For quality control, the quality of the bonding process can now be controlled by visual inspection or by means of a pull and shear test.
MAF can integrate several chips, as well as entire functional groups of components, into a single package.
After release, a fully automatic
molding process begins. The lead frame with the bonded chips is over- molded with an epoxy resin by a mul- tiple plunger and tempered. Then the components are marked according to customer specifications with a fiber laser, which can be flexibly and quickly programmed for the required application. After marking, the dam- bars are cut. The next process step involves
cleaning, activating and tinning of the lead frame and also of the pins with lead-free tin. To avoid whisker formation, a further temper process is carried out after tinning. Fully automatic bending and separation of the electrical components by a trim- ming and forming machine, as well as the subsequent packing (in tray, tube or reel), completes the packaging process. In addition to the packaging in
Wafer dicing is the process by which die are separated from a semiconductor wafer.
standard plastic packages (PQFP, SOP, SSOP, QFN, and DFN), MAF also offers sample production in pre- mold or ceramic packages. The company also offers development and production of customer-specific packages for special applications, such as those with several die or in transparent packages, and chip-on- board assembly to save PCB space. MAF is also able to create dummy packages for testing and design pro-
totyping. Contact: MAF Microelectronics Assembly
Frankfurt (Oder) GmbH, Otto-Hahn-Strasse 24, D- 15236 Frankfurt (Oder), Germany % +49-0-335-38- 719-63 E-mail:
maletic@htv-gmbh.de Web:
www.maf-ffo.de r
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