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www.us- tech.com


December, 2020


Reliable Low-Volume Wafer Plating From Technic


CRANSTON, RI — Technic’s SEM- CON 1000 is an essential tool for wafer deposition evaluation and ap- plication performance testing. The SEMCON 1000 has been designed and developed specifically for research and low-volume applications testing and production. The tool has a single plat- ing cell along with a drag-out rinse cell to enable plating/electroforming of wafers or discrete parts, when used with a customized holder. The SEMCON 1000 can process


several different types of plating on a variety of substrates, including Si, GaAs, InP, and more. The system is modeled after Technic’s highly suc- cessful SEMCON 2000 series of man- ual wafer wet bench tools. The SEMCON 1000 is self-con-


tained, constructed of white polypropy- lene, with a clear PVC process cover that is designed to meet Class 1000


cleanroom specifications. Plating cell components include a heating source, temperature control, low-level safety


SEMCON 1000 system. sensor, pump and filter, DC power sup-


ply, and a plating rack. Contact: Technic, 47 Molter


Street, Cranston, RI 02910 % 401-781-6100


E-mail: info@technic.com Web: www.technic.com


LPKF’s Laser Depaneler Minimizes Particle Deposits


TUALATIN, OR — LPKF’s Cutting- Master 3565 laser depaneler has been designed to cleanly separate PCBs and prevent deposits of particle contamination, eliminating the need for cleaning steps after processing. The stress-free laser cutting of


the entire PCB contour eliminates the need for mechanical routing prior to assembly. Since the usual pre- milled 0.08 to 0.12 in. (2 to 3 mm) wide channels are no longer required, it offers 30 percent more space on the panels. The laser beam requires only


a few microns as a cutting channel. The system’s sophisticated software makes the CuttingMaster 3565 easy to operate, which also minimizes pro- duction cycle time. No significant mechanical or thermal stress is caused during laser cutting. Debris generated during ablation is extract-


ed directly at the cutting channel. Contact: LPKF Laser & Elec-


tronics, 12555 SW Leveton Drive, Tualatin, OR 97062 % 503-454-4200 E-mail: marketing@lpkfusa.com Web: www.lpkfusa.com


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