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www.us-tech.com
December, 2020
Chipset-Specific IPDs Simplify Next-Gen Wireless IoT Applications
By Jeff Elliott F
or the next generation of low- cost, battery operated, wireless IoT products, the design goal is
to provide exceptional RF signal range and stability, while also reduc- ing power consumption, in a minia- turized package. As a result, leading RF chipset and component manufac- turers are increasingly fine-tuning and improving their products to do just that. One example is the introduction
of miniaturized, frontend integrated passive devices (IPDs), specifically designed to seamlessly connect with Semtech’s LoRa® SX1261, SX1262 and LLCC68 chipsets. According to Semtech, a suppli-
er of analog and mixed-signal semi- conductors, LoRa and LoRaWAN® are already the “de facto technology for Internet of Things (IoT) networks worldwide” and will provide long- range connectivity for a variety of IoT applications including next-gen- eration “smart” everything — cities,
homes, buildings, agriculture, meter- ing, supply chains, and logistics.
Smarter and Smaller To make PCBs smaller, chipset
For the LoRa platform, specifi-
cally, the ability to integrate all the RF components into a much smaller, low profile package would only increase the attractiveness of the chipset for miniaturized, battery powered IoT products. Without this option, OEMs would have to design the entire capacitor/inductor scheme and mount many separate compo- nents onto the printed circuit board. “OEMs now have the option to
utilize the integrated solution as opposed to the inductor and capacitor discrete solution. Using a Johanson IPD makes the final PCB size smaller and simpler,” says Carmona. “Also, any changes in the geometry of the layout can affect the output perform- ance, battery life and signal range.” In this case, the RF circuitry
Chipset-specific integrated passive device from Johanson Technology.
manufacturers, like Semtech, create reference designs that third parties can adapt and modify as required. The reference design serves as proof of the platform concept and is usual- ly targeted for specific uses. The goal is to fast track products to market by using Johanson’s front-end solutions, thereby reducing risk in the OEM’s integration project. “The starting point is the
chipset, but the chipset requires spe- cific RF circuitry to connect to the antenna,” explains Manuel Carmona of Johanson Technology, a leader in high-frequency ceramic components, including chip antennas, integrated filters/baluns, high-Q capacitors and EMI chip filters.
required is used to convert the signal from differential to single-ended in a specific impedance ratio using an impedance matching network and a balun. Most chipsets require this type of conversion due to the differ- ential, two pin input/output configu- ration to connect with the single- ended antenna. “For many chipsets, the output
straight out of the chipset is usually not matched to 50 ohms, which requires one to have an impedance matching network that must be designed in order to avoid loss of power signal, reduced battery life and decreased signal range,” says Carmona.
Creating an IPD To meet the requirements,
Johanson Technology collaborated with Semtech to develop an IPD that
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