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Association & institutes news Title Association & institutes news


2011 IPC International Technology roadmap kicks up some gravel with controversy With only five months left in its development, the 2011 IPC International Technology Roadmap for Electronic Interconnections is paving its way to being the most controversial roadmap to date. Several new topics and features have been incorporated into the roadmap to provide users with revealing data and comparisons that will shake up the careful balance between technologies and reliability. Published biennially, the IPC Roadmap


has served as the authoritative guide to interconnect technological trends, providing a visualization of imminent, innovative technology. Exclusive to the electronic interconnect industry, the roadmap provides a route for achieving the vision—going from today into the future—by guiding companies in identifying, selecting and developing the right technology alternatives needed to create the products needed for future markets. “We’ve turned the roadmap inside out


to help users connect the dots a little easier, in terms of translating OEM system level requirements into the materials, features, structures and process requirements for printed boards and assemblies to support those needs,” says John (Jack) Fisher, president of Interconnect Technology Analysis, Inc. and chairman of the IPC Roadmap Executive Committee. “But perhaps a little harder to swallow will be the eye-opening data they’ll discern from the new regional analysis we’ve added.” The 2011 roadmap includes expanded


regional analysis and comparison. In both the substrate and assembly sections, the 2011 roadmap will provide insight into the regional differences in capability between Asia, Europe and North America—an addition that Dieter Bergman, IPC director of technology transfer, believes will, “kick up a little controversy.” As Bergman explains, the new data will shed light on the important difference between acknowledging a technology and actually having the capability to employ it. “The implications for a company


seeking a qualified supplier are profound,” says Bergman. “We’re equipping users, especially purchasing staff, with information to go from making a cheap decision to an informed decision.” Another essential addition to the


2011 Roadmap is the link of emulators to industry standards and specifications. A new section will discuss the changes that need to occur in industry standards content to make them relevant to tomorrow’s needs, including the addition of a state-of-the-art level for product features that demand a higher degree of precision. A poignant look into the disparate attitudes toward and acceptance of standards in different regions of the world will also be included. The IPC Roadmap Committee


invites anyone interested in joining their final few meetings, including teleconferences, in November, December and January, to contact IPC. For details on the meeting dates, times and topics, contact IPC Manager Jeanne Cooney at JeanneCooney@ipc.org or +1 847-597- 2842. www.IPC.org


New IPC study on worldwide EMS industry forecasts growth through 2014 Despite economic setbacks in 2009, the world market for electronics manufacturing services (EMS) is returning to double- digit growth, according to a study recently released by IPC—Association Connecting Electronics Industries®. The study, 2009–2010 Analysis and Forecast for the EMS Industry, examines critical trends and provides forecasts and potential for market expansion. The EMS sector was the last in the


electronics supply chain to feel the impact of the global recession and the last to rebound in 2010. As the world’s economies recover, the global EMS market is projected to grow at an annual average rate of 12.2 percent through 2014, based on a forecast provided for this report by New Venture Research Corp. (NVR), formerly Electronic Trend Publications. IPC’s own forecast of assembly market growth in North America projects a spike of 28 percent in 2010 as recovery takes hold, and a return to more normal growth of 12 percent in 2011. The study provides general business


52 – Global SMT & Packaging – Celebrating 10 Years – December 2010


metrics on the sample of 95 EMS operations that participated in the annual survey by region, including North America, Europe and Asia, along with trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials, and market size. In addition, the study highlights major end markets for EMS activity by region. 2009–2010 Analysis and Forecast


for the EMS Industry is available for purchase to IPC members for $475 and to nonmembers for $950 from www.ipc.org/ ems-industry-forecast.


SMTA International Indicates Strong Industry Recovery The SMTA released a summary of the SMTA International Conference and Exhibition, which took place October 24-28 in Orlando, FL, and enjoyed a 20% increase in total registration and served as another indication that the industry is making a healthy recovery. The technical conference was well-


received and continued the SMTAI tradition of having the strongest technical conference in the industry. The Lead- Free Symposium continued to be a big draw. The AIMS Harsh Environment Symposium, included in the technical program this year, was successful. The session on printed electronics was the most popular session in the entire Evolving Technologies Summit. The riveting Keynote Address by Tom Sharpe, SMT Corporation, gave a sobering if not downright scary perspective of the effect of counterfeit electronic components on the electronics assembly industry. Over 120 exhibiting companies filled


the sold-out exhibit hall, a more than 30% increase from last year. The well-attended show floor maintained a steady buzz throughout the event. The 2011 SMTAI Conference and


Exhibition will be held at the Fort Worth Convention Center in Fort Worth, Texas on October 16-20, 2011. www.smta.org


www.globalsmt.net


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