Logitech Silicon_Ad_May2013v2flighted.pdf 1
19/09/2013
11:45 ADVERTORIAL
Optimum surface quality on Silicon based substrates
Semiconductor organisations worldwide realise the benefits of Logitech Precision Systems for the preparation of substrates from hard materials such as Silicon, Silicon Carbide, Sapphire and CVD Diamond.
Logitech Limited has invested heavily in the last year to advance system technologies within key product areas. A high level of success has been achieved in the areas of: £ Superior load and controllability for increased material removal rates, while maintaining low surface damage
£ Enhanced plate flatness monitoring and higher accuracy jig control for superior flatness and TTV
£ Development of user friendly, industry standard software platforms.
In response to client and market demand Logitech has developed a High Speed Lapping and Polishing System, primarily for hard materials. This benchtop solution is ideally suited to research laboratories and small scale production, due to its flexibility, reliability and low cost of ownership. The system is perfect for the processing and pilot production analysis of Silicon and Silicon based substrates.
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An array of advanced in-situ sensors constantly provide the operator with real-time process information. Monitored parameters include Coefficient of Fricton, slurry and pad/plate interface temperatures.
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• Lapping Systems • Polishing Systems • CMP Systems • Wafer Bonding Equipment • Cutting and Sawing Equipment • Testing and Measurement Equipment • Consumable Products
All of which are paramount for optimal performance. The High Speed Lapping and Polishing system can process substrates, wafers and part wafers up to 100mm/4” diameter quickly and easily due to the 300rpm variable plate speed and higher sample load capability. The user friendly interchangeable plate/ pad design ensures that the High Speed system maintains maximum efficiency across the complete process. This is further highlighted with the high level of automated system operations and programmability, allowing full processes or sub processes to be run with minimal intervention.
Key applications for Logitech Lapping and Polishing Systems include: £ Wafer polishing to sub-nm levels £ Removal of epi-layers with nanometer level precision £ Capability to delayer up to 100mm (4”) diameter wafers £ Polishing accuracy to nanometer levels for fault isolation £ Preparation of substrates for use in electronic device manufacture
Further information on Logitech technology, system solutions and material processing can be found at
www.logitech.uk.com or by contacting our team on: +44 (0) 1389 875444.
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System solutions for substrate preparation
Where applications demand precise tolerances and optimum surface finish.
Contact us today for more information about our system solutions or visit us at Semicon West.
www.logitech.uk.com enquiries@logitech.uk.com T: (0) +44 1389 875444
Issue IV 2013
www.siliconsemiconductor.net 29
29/05/2013 15:52:45
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