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Volume 35 Issue 04 2013


features COVER STORY


26 Die and flip-chip bonding striving for ultra high precision Cost-effective surface mounting of complex stacked die using TSV interconnect calls for ultra-high-precision die and flip-chip bonders. Consequently, back-end equipment vendors and process designers must come up with modular concepts to accommodate a broad scope of micro-assembly tasks.


30 Meeting advanced packaging geometries


through material advancements The boom in the mobile market with increasing demands for smaller geometries has created the need for novel and innovative chemistries to overcome the limitations of existing materials.


34 Europe’s semiconductor industry can become a global force again


The European Commission’s decision to spend up to 10 billion euros for R&D activities will create new opportunity for Europe globally.


36 MUF and wafers get new acoustic tools Modifications of production processes and changes in device dimensions


require new non-destructive techniques to inspect for reliability.


42 Testing modern power semiconductor devices requires modern curve tracers


The traditional curve tracer has significant limitations when it comes to testing modern power semiconductor devices. Fortunately, the Source Measure Unit (SMU) offers a capable test solution.


30 Volume 35 Issue 4 2013


Material advancements


@siliconsemi www.siliconsemiconductor.net


Cost-effective surface mounting of complex stacked die


New acoustic tools for wafers


Die and fl ip-chip bonding strive for ultra high precision


Europe’s new global force


industry research 14 Taking nanoscale lithography into the third dimension 16 Revolutionising electronics with nanotechnology 18 Simplifying MEMS pressure sensor technology


Revolutionising electronics


Desktop printing on a nanoscale


20 Desktop printing can process semiconductors on the nanoscale


Features, News Review, Industry Analysis, Research News and much more. Free Weekly E News round up , go to www.siliconsemiconductor.net


Front Cover SiS v1.indd 1 18/09/2013 14:17


Magazine and Front Cover designed by Mitch Gaynor


22 Era of atomic-scale semiconductor devices 24 Scotch tape makes electronic devices smaller and better


34 Issue IV 2013 www.siliconsemiconductor.net 5 26


contents CONNECTING THE SILICON SEMICONDUCTOR COMMUNITY 16


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